Advanced Polishing Methods for Atomic-Scale Surfaces: A Review
Zhun Luo,Zhenyu Zhang,Feng Zhao,Cheng Fan,Junyuan Feng,Hongxiu Zhou,Fanning Meng,Xuye Zhuang,Jianmei Wang
DOI: https://doi.org/10.1016/j.mtsust.2024.100841
IF: 7.244
2024-01-01
Materials Today Sustainability
Abstract:With the development of high-performance components in advanced equipment, manufacturing precision and scale are approaching to atomic-scale, especially in the fields of electronic information, integrated circuits, and ultra-precision instruments towards miniaturization and portability. Surface roughness with Ra less than 0.2 nm has attracted considerable attentions for ultraprecision machining, owing to inducing unique properties of components and great potential in a wide range of applications. Great efforts have been devoted to production of atomic surfaces on components through machining their surface layer at the atomic scale. In this review, advanced polishing methods have been addressed, such as chemical mechanical polishing (CMP), elastic emission machining (EEM), ion beam figuring (IBF), magnetorheological finishing (MRF), plasma-assisted polishing (PAP), ultrasonic and photocatalytic polishing, electrochemical polishing, and bubble-assisted polishing. Although present advanced polishing methods and technologies have achieved partially progresses, atomic-scale surface and atomic layer removal are generally a new field of research developed recently. This review focuses on advanced polishing at atomic scale for enhancing the performance of components made of different materials. It covers the application and development of new equipment, novel processes, and innovative abrasive particles, such as CeO2, etc. Additionally, future trends of research works are also discussed.