The inhibitory effect of 2‐deoxyglucose on insulin receptor autophosphorylation does not depend on known serine phosphorylation sites or other conserved serine residues of the receptor β‐subunit

V. Strack,B. Bossenmaier,B Stoyanov,L. Mosthaf,M. Kellerer,R. Lammers,H. Häring

DOI: https://doi.org/10.1016/S0014-5793(99)00409-3

1999-04-23

FEBS Letters

Abstract:

What problem does this paper attempt to address?

Residual Stress Distribution in A Copper-Aluminum Multifilament Composite Fabricated by Rotary Swaging

David Canelo-Yubero,Radim Kocich,Jan Šaroun,Pavel Strunz

DOI: https://doi.org/10.3390/ma16052102

IF: 3.4

2023-03-06

Materials

Abstract:Rotary swaging is a promising technique for the fabrication of clad Cu/Al composites. Residual stresses appearing during the processing of a special arrangement of Al filaments within the Cu matrix and the influence of the bar reversal between the passes were studied by (i) neutron diffraction using a novel evaluation procedure for pseudo-strain correction and (ii) a finite element method simulation. The initial study of the stress differences in the Cu phase allowed us to infer that the stresses around the central Al filament are hydrostatic when the sample is reversed during the passes. This fact enabled the calculation of the stress-free reference and, consequently, the analysis of the hydrostatic and deviatoric components. Finally, the stresses with the von Mises relation were calculated. Hydrostatic stresses (far from the filaments) and axial deviatoric stresses are zero or compressive for both reversed and non-reversed samples. The reversal of the bar direction slightly changes the overall state within the region of high density of Al filaments, where hydrostatic stresses tend to be tensile, but it seems to be advantageous for avoiding plastification in the regions without Al wires. The finite element analysis revealed the presence of shear stresses; nevertheless, stresses calculated with the von Mises relation show similar trends in the simulation and in the neutron measurements. Microstresses are suggested as a possible reason for the large width of the neutron diffraction peak in the measurement of the radial direction.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Al-clad Cu Bond Wires for Power Electronics Packaging: Microstructure Evolution, Mechanical Performance, and Molecular Dynamics Simulation of Diffusion Behaviors

Wenting Liu,Xinyue Wang,Jing Zhang,Guoqi Zhang,Pan Liu

DOI: https://doi.org/10.1016/j.mtcomm.2024.110940

IF: 3.8

2024-01-01

Materials Today Communications

Abstract:With the advancement of power electronics, aluminum-clad copper thick bonding wires have garnered attentions due to superior electrical and thermal properties, making them well-suited for high-temperature and high-current applications. However, the impact remains unveiled of whether the growth of intermetallic compounds (IMCs) at the bonding interface presents critical challenges to the reliability of wedge wire bonds. Therefore, it is necessary to investigate the evolution behavior of Cu/Al IMCs in Al-clad copper wires. In this study, Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) were firstly employed to characterize the phase composition and growth behavior of Cu/Al intermetallic compounds (IMCs) at two distinct interfaces—the bonding interface and the core-shell interface—under various annealing conditions during high-temperature storage (HTS) tests, revealing a parabolic relationship between aging time and IMCs thickness. Subsequently, shear and pull tests of Al-clad copper bond wires were conducted to evaluate the bonding strength under different aging conditions, clarifying the correlation between various failure modes of the bonds and the evolution of IMCs at the bi-interfaces of this novel composite across different aging stages. Additionally, molecular dynamics (MD) simulations were employed to explore the diffusion behavior of Cu and Al atoms. It revealed that polycrystalline structures enhanced the mutual diffusion at the interface, with copper serving as the predominant element in the interdiffusion process. In conclusion, this study integrates experimental and numerical approaches to elucidate the growth mechanisms of Cu/Al intermetallic compounds and their effects on reliability, providing valuable guidance for optimizing the performance of composite bonding wires in high-temperature power device applications.
Novel approach to optimize the mechanical properties of Cu-Al composite wires

Alireza Dashti,Clément Keller,Benoit Vieille,Alain Guillet

DOI: https://doi.org/10.1007/s12289-022-01697-1

2022-05-07

International Journal of Material Forming

Abstract:The present study is concerned with the mechanical properties of Cu-Al wires manufactured via cold drawing. The common approach for improving the tensile strength of drawn wires is to optimize the operational parameters. Those parameters include the die geometry, amount of area reduction at each pass, drawing speed, lubrication and so on. Optimization helps homogenize the plastic deformation during wire drawing. That in turn minimizes the undesirable effect of processing-induced tensile residual stresses forming near the wire surface. The current investigation introduces a novel optimization approach to modify the residual stress distribution with a focus on the fiber-matrix configuration rather than the operational parameters. To that end, residual stress distributions in the two configurations I- conventional copper-clad aluminum and II- so-called "Architectured" wires were compared at the same Cu/Al volume fraction. The comparison was performed using the finite element analysis. Experimental stress–strain curves, numerical residual stress profiles, and equivalent plastic strain contours were then plotted for both conventional and novel configurations. The findings suggest that the novel composite wires offer remarkably better tensile behavior along with other already-known electrical and thermal advantages. This could be ascribed to their architectural features such a continuous copper network and fine Al fibers. Therefore, the new fiber-matrix configuration could remove the need for optimization of various operational parameters or post-drawing treatments for a given wiredrawing set-up.

materials science, multidisciplinary,metallurgy & metallurgical engineering,engineering, manufacturing
Assembly of a trinuclear metallo-capsule from a tripodal tris(beta-diketone) derivative and copper(II).

D. J. Bray,Bianca Antonioli,J. Clegg,K. Gloe,K. Gloe,K. Jolliffe,L. Lindoy,G. Wei,Marco Wenzel

DOI: https://doi.org/10.1039/b717685f

IF: 4

2008-03-19

Dalton Transactions

Abstract:A new metallo-capsule has been synthesised that consists of three copper(II) ions and two molecules of a tris-deprotonated tripodal ligand in which three 2,4-pentanedione groups are linked via their gamma-carbons through thioether spacers to the 1,3,5-positions of a triazine core.
Effects of Deformation on the Mechanical Properties of Deformation Processed Ag-20Cu Macro-composite Wires

耿永红,郭迎春,毕珺,张吉明,王传军,陈松,管伟明,张昆华

DOI: https://doi.org/10.3969/j.issn.1004-0676.2009.04.004

2009-01-01

Abstract:The deformation processed Ag-20Cu(wt%) macro-composites were fabricated by metal cladding,post-extruding and then cold-drawing.The mechanical properties of the composite wires were tested and the dimensions of Ag and Cu layers were measured quantitatively depending on the scanning electron microscopic images.The effects of deformation on the mechanical properties of Ag-20Cu wires were investigated.The results indicated that the mechanical properties increase at low strain stage because of the work-hardening of Cu layers and pile-up of dislocation at the interface and decrease at high strain stage mainly due to the recovering of Ag layers.
(Sub)structure Development in Gradually Swaged Electroconductive Bars

Jaromír Kopeček,Lucia Bajtošová,Petr Veřtát,Daniel Šimek

DOI: https://doi.org/10.3390/ma16155324

2023-07-28

Abstract:Copper generally exhibits high electrical conductivity but has poor mechanical properties. Although alloying can improve the latter characteristic, it usually leads to a decrease in electrical conductivity. To address this issue, a promising approach is to enhance the performance of copper while maintaining high electrical conductivity through optimized deformation processing, which refines the structure and increases mechanical properties. This paper focuses on assessing the effects of rotary swaging, a form of deformation processing, on microstructures and substructures of electroconductive copper bars. This analysis is complemented by experimental measurements of electrical conductivity. The results demonstrate that gradual swaging, i.e., applying different swaging ratios, influences the structure-forming processes and consequently affects the electrical conductivity. The increased electrical conductivity was found to be associated with the elongation of the grains in the direction of the electron movement.
Fabrication of a novel high-strength and high-conductivity copper-clad aluminum composite wire

Farnousheh Sharifian Amiri,Seyed Jamal Hosseinipour,Hamed Jamshidi Aval,Roohollah Jamaati

DOI: https://doi.org/10.1016/j.cirpj.2022.12.004

IF: 4.8

2023-01-01

CIRP Journal of Manufacturing Science and Technology

Abstract:The present study is focused on characterizing the microstructure, mechanical properties, and electrical resistance of a novel copper-clad aluminum composite wire. In this regard, the extrusion and wire drawing processes have been used to produce the composite wire. After every deformation step, intermediate annealing was performed at a temperature of 300 °C for 30 min. The microstructure has been investigated using an optical microscope (OM) and a scanning electron microscope (SEM) equipped with energy dispersive spectroscopy (EDS). Besides, microhardness and tensile tests were utilized to determine mechanical properties. Also, a micro-ohmmeter was employed to measure the electrical resistance. The findings indicated that the composite wire's interface was uniform and homogeneous without evidence of thick and continuous intermetallic compounds (IMCs). A comparison between oxygen-free high conductivity (OFHC) copper and composite wire demonstrated that applying a reduction ratio to 99.6% on the composite wire resulted in electrical conductivity higher than 66.8% IACS. Also, the ultimate tensile and yield strengths were increased 37% and 183%, respectively. The strength improvement was attributed to the fine particle distribution in the aluminum alloy core and the residual stress caused by the different elastic properties of the two materials during deformation.

engineering, manufacturing
Effect Of Intermediate Annealing On The Interface And Plasticity Of Cu-Ni-Si/Al-Mg-Si Clad Composite Wires

Zhen Yang,Xujun Mi,Haofeng Xie,Lijun Peng,Guojie Huang,Xue Feng,Xiangqian Yin

DOI: https://doi.org/10.1007/978-981-13-0104-9_91

2018-01-01

Abstract:The aim of this article is to study the effect of intermediate annealing on the interface and plasticity of Cu-Ni-Si/Al-Mg-Si clad composite wires. Cu-Ni-Si/Al-Mg-Si clad composite wires were produced by cold drawing process and annealed at the temperature from 150 to 350 degrees C for 0.5 h. The presence of various intermetallic compounds in different temperature was detected by scanning electron microscope and EDS analyzer. The mechanical properties were measured by stretch test. The elongation increased with the temperature increment. The morphology of fracture showed that intermetallic compounds were tough and brittle. During the subsequent drawing, the intermetallic compounds were harmful to the overall structure of composite wires. The elongation cannot identify the plasticity of copper-clad aluminum (CCA) composite wires accurately.
Deformation and Fracture Behavior of Electrocodeposited Alumina Nanoparticle/Copper Composite Films

Yong X. Gan,Chih-Shing Wei,Marca Lam,Xiaoding Wei,Dongyun Lee,Jeffrey W. Kysar,Xi Chen

DOI: https://doi.org/10.1007/s10853-006-0369-0

IF: 4.5

2007-01-01

Journal of Materials Science

Abstract:Electrocodeposition of alumina nanoparticles and copper thin film on silicon wafers was performed. The volume fraction of the nanoparticle is about 5% and the size is about 50 nm. Comparison between the static tensile behaviors of specimens with and without nanoparticles reveals that the Young's modulus is significantly increased by incorporating nanoparticles into the copper film. However, the ultimate tensile strength of the nanocomposite (235 MPa) is slightly lower than that of the pure copper reference specimen (250 MPa). For the nanocomposite, the strain at failure is 7.8%, which is lower than that of the pure copper film (10.5%). Distinct microscale deformation mechanisms are observed: the main deformation mechanism of the pure copper film is slip followed by strain hardening, whereas for the nanocomposite, multistage failure behaviors are found due to the debonding at the nanoparticle/copper interface. Notched specimens were also tested and compared with the unnotched specimens. In addition, cyclic loading tests on the nanocomposite were conducted to show its hardening behavior.
Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

Hafız Muhammad Numan Zafar,Fehmi Nair

DOI: https://doi.org/10.1177/14644207221090534

2022-04-04

Abstract:Deformation processed wires are used in the fields which demand the combination of contradictory properties such as mechanical strength and electrical conductivity. For the last 4–5 decades, scientists have focused on fabricating Cu and Al matrix wires using various plastic deformation techniques. While the high electrical conductivity is ensured through mentioned elements, the strength is achieved by orderly employment of plastic deformation and various heat treatments for basically achieving microscale filamentary structure of reinforcing elements. However, the strict selection criteria of starting materials and contradicting nature of processing regime and expected properties require proper knowledge of materials-microstructure and fabrication-property correlations. This paper summarizes the manufacturing methods, processing parameters-microstructure interactions, consequential mechanical and electrical properties and finally, current, and potential applications of deformation processed bi-metallic composite wires. It will help engineers, through provided comparative analysis, choose appropriate processing routes and starting materials for the realization of high strength/conductivity wires as well as guide what to expect in terms of targeted properties.
Stress-Strain Distribution Within Rotary Swaged Tungsten Heavy Alloy

Ludmila Krátká,Rudolf Petrmichl,Ludmila Krátká and Rudolf Petrmichl

DOI: https://doi.org/10.1088/1757-899X/1190/1/012011

2021-10-13

IOP Conference Series: Materials Science and Engineering

Abstract:This study deals with thorough investigation of stress-strain parameters within an innovatively processed tungsten heavy alloy (THA). THAs are challenging materials featuring exceptional mechanical and physical properties and they are applicable in various demanding industrial fields, such as in the aeronautics, medicine, or military. The herein studied material is a WNiCo alloy prepared from original powders via powder metallurgy. The pre-sintered material was processed via plastic deformation, in particular hot rotary swaging with the usage of induction heating directly before a swaging pass. The experimental study was supplemented with numerical simulation of the deformation process, which was performed via the finite element method (FEM). The simulation was primarily focused on prediction of the development of effective imposed strain during the swaging process performed in multiple steps, and its correlation with stress distribution during swaging. The numerically predicted effective imposed strain development was subsequently verified via Vickers microhardness measurements, whereas the predicted results of stress distribution were validated via experimental observation of residual stress distribution performed via analysing scans acquired by scanning electron microscopy (SEM, electron backscatter diffraction analysis). The results showed that the deformation technology consisting of induction heating and hot rotary swaging was well optimized as the swaged billets featured satisfactory surface roughness and no surface cracks. Also, the tungsten agglomerates within the structure exhibited deformation in the direction of the main acting swaging force, especially in the locations the effective imposed strain in which was the highest. The values of predicted effective imposed strain and microhardness correlated reliably with the experimentally acquired and predicted results of residual stress distribution. In other words, the locations the effective strain in which was the highest also exhibited a more significant presence of residual stress.
Effects of Cr addition on the microstructural, mechanical and electrical characteristics of Cu–6wt.%Ag microcomposite

L. Zhang,L. Meng,J.B. Liu

DOI: https://doi.org/10.1016/j.scriptamat.2004.11.035

IF: 6.302

2005-01-01

Scripta Materialia

Abstract:Cu–6wt.%Ag and Cu–6wt.%Ag–1wt.%Cr microcomposites were prepared by heavy drawing. The morphology of filamentary bundles was observed and the tensile strength and electrical conductivity determined. The effect of Cr addition was discussed according to the changes in the microstructure, strength and conductivity with various draw ratios for both alloys.
Deformation characteristics of metal clad metal Ag-20Cu macro-composite by severe plastic deformation

Yonghong Geng,Yingchun Guo,Jun Bi,Jiming Zhang,Chuanjun Wang,Song R. Chen,Weiming Guan,Kunhua Zhang

2010-01-01

Rare Metal Materials and Engineering

Abstract:Ag-20Cu macro-composite wires (volume fraction, %, similarly hereinafter), a new DMMCs(Deformation Metal-Metal Composites), were fabricated by metal clad metal method and post-severe plastic deformation. The mechanical properties of the composite wires were tested at different true strains Pi, and the size change of the Ag layer and the Cu layer and fracture morphology were observed by SEM. The deformation characteristics of the Ag layer and the Cu layer for the Ag-20Cu composite were studied by the above experiments. The results indicate that the deformation process of the composite mainly contains cooperating deformation between Ag and Cu layers due to their different mechanical properties and the modes of cooperating deformation at different stages are different. Because of work-hardening and recovery to different degrees during deformation, the property change trend of the composite is different and the effects of Ag and Cu layers on the properties of the composites are unlike.
Texture characteristics and tensile deformation behavior of Cu/Al layered composites prepared by cast-rolling method

Youcheng Zhang,Aiqin Wang,Tingting Liang,Jinhao Zhang,Zhiping Mao,Jiale Ji,Jingpei Xie,Qinghua Chang,Bo Su,Shuaiyang Liu

DOI: https://doi.org/10.1016/j.jmrt.2024.01.164

IF: 6.267

2024-03-01

Journal of Materials Research and Technology

Abstract:The cast-rolling composite method was used to create a Cu/Al layered composites with thickness of 5 mm. The organizational structure, and strain distribution of the composites, were characterized using SEM, TEM, and EBSD. The mechanical characteristics of the composites was determined, and the evolution pattern of the interface under different strains were observed, the microstructures and tensile deformation behaviors of the test material was analyzed. The results show that the microstructure of the test material showed a multilevel layered structure, and at the interface, an Al2Cu + Al4Cu9 intermetallic compounds (IMCs) with a thickness of 380 nm produced. The Al layer's grain size displays a gradient distribution at the micron scale. There are certain differences in Al grain morphology and strain distribution between the rolling direction (RD) and transverse direction (TD). And there are large differences in the grain orientation of the Al grains along the normal direction (ND). There are some twins in the Cu layer, and the grains have no obvious preferential orientation. Cu/Al composites have a higher plasticity than pure Cu and pure Al. In the process of tensile fracture, the cracks are first initiated in the interface layer, but did not expand directly in the longitudinal direction, and after the interfacial restraining effect reached the limit, expansion of cracks into the Cu and Al layers and eventual fracture of the test material. The toughening mechanism of the test material was also analyzed.

materials science, multidisciplinary,metallurgy & metallurgical engineering
The crucial role of accumulated strain and Cu content on the electrical, thermal, tensile, fracture, and microstructure characteristics of Al/Cu multi-layered composites subjected to SPD

Ke Wang,Xukai Ren,Yu Zhang,Guang Chen,Yaofeng Wu

DOI: https://doi.org/10.1016/j.mtcomm.2024.110338

IF: 3.8

2024-09-08

Materials Today Communications

Abstract:This work investigates how accumulative strain and Cu content (45, 62, 77 wt%) impact the structural, mechanical, thermal, and electrical properties of the Al/Cu composite fabricated via the ARB technique. According to the results, an increase in the Cu wt% led to the rise of plastic instability emergence rate, tensile strength, microhardness, and electrical and thermal conductivity. Moreover, as the strain increased during ARB passes, the distribution of hard layers, strength, and microhardness of the composites increased while the elongation, electrical resistivity, and thermal conductivity decreased. The peak tensile strength reached 375 MPa in the fifth pass for Al/77Cu. However, the max electrical and thermal conductivity values of 69.5 % IACS and 180 W/m/K were achieved in the first pass for Al/77Cu. Examination of the fracture surfaces of the post-tensile test specimens indicated that the predominant fracture mode following the ARB process is a shear ductile fracture.

materials science, multidisciplinary
Impact of hardening law on the FEM prediction of residual stresses in copper-clad aluminum wires

DOI: https://doi.org/10.1007/s00170-023-11315-2

2023-04-05

Abstract:Near-surface axial tensile residual stresses (from manufacturing) are reportedly detrimental to the yield strength of cold-drawn wires. Therefore, a reliable evaluation of their magnitude is necessary. The size and geometry of electrical wires can pose challenges for experimental measurement of those residual stresses. For that reason, the finite element analysis can prove useful. However, great care must be taken with the right choice of strain hardening law for a sound assessment of residual stresses. Given the complex loading condition during cold drawing, cyclic loading arises through the wire cross section even in single-pass drawing. As a result, it is of crucial importance to account for associated backstresses. The current study makes a comparison between two different hardening laws' prediction of axial residual stress profiles in numerically cold-drawn Cu–Al composite wires of various Al volume fractions. The impact of die geometry on this prediction was also examined for a 25%Al-wire. To that end, a combined isotropic-kinematic law and a pure isotropic constitutive equation were considered. The results imply a possible overestimation of residual stresses by the pure isotropic model at relatively low Al volume fractions. The difference between the maximum magnitudes of tensile or compressive residual stresses (predicted by the two models) could be as large as about 100 MPa (larger than the yield strength of the starting materials). Furthermore, the tooling geometry minimally affects the prediction of the hardening models. In conclusion, backstresses are not to be overlooked for accurate estimations of drawing residual stresses at low Al volume fractions.

engineering, manufacturing,automation & control systems
Studies on wire hot extrusion processes of metals and metal/CNT

Bai, Yuanli

DOI: https://doi.org/10.1007/s00170-023-12941-6

IF: 3.563

2024-01-11

The International Journal of Advanced Manufacturing Technology

Abstract:Wire hot extrusion was investigated to produce thin wires of metals and metallic matrix nanocomposites, including aluminum (Al), copper (Cu), and copper/carbon nanotube composites (Cu/CNT, 1%wt). A new energy-based analytical solution was developed to predict extrusion force, where friction effect between die and sample was considered. This analytical solution achieved a much better result than the classical slip line theory and other existing analytical solutions, where friction effect was usually not considered. Finite element (FE) models using ALE method were built to validate the analytical solution under different extrusion conditions. A series of FE simulations were run for different die angles (30°, 45°, and 60°) and two different area extrusion ratios (4:1 and 16:1). The comparison results showed a very good correlation between the analytical solution and FE results. Four wire extrusion tests of metals and Cu/CNT composite were conducted under elevated temperatures (about 300 to 700 °C). Test results further proved the excellent accuracy of the analytical solution and the necessity of considering friction effect. Trade-off between high temperature oxidation and material fracture during wire extrusion for less ductile materials was also briefly discussed.

engineering, manufacturing,automation & control systems
High deformation and delamination mechanisms explained through mesoscale and nanoscale phenomena in pearlitic steel wires

Elena Brandaleze,Mykhaylo Romanyuk,Jenifer Barrirero,Frank Mücklich,Norbert Schell,Heinz-Günter Brokmeier,Martina Ávalos,Raúl Bolmaro

DOI: https://doi.org/10.1051/metal/2023089

IF: 0.9461

2024-01-14

Metallurgical Research & Technology

Abstract:Pearlitic steel wires subjected to severe cold drawing deformation exhibit a unique combination of high strength and excellent ductility, making them suitable for critical applications such as hanging bridge cables, crane cables and tire cord. Torsion tests up to rupture are commonly used in the industry for quality control purposes. A flat fracture surface is indicative of wire aptitude, while a delaminated surface suggests degradation of mechanical properties. This paper aims to expand the understanding of the structural evolution and deformation mechanisms that occur during wire drawing, as well as the origin of delamination problems. Different deformation and strengthening mechanisms are identified and discussed, applying different microscopy techniques (optical microscopy, scanning electron microscopy, electron backscatter diffraction), synchrotron diffraction and atom probe tomography. The information is correlated with the cementite stability on the structure studied at meso, nano, and atomic scale, reaching an understanding of the compositional evolution of cementite and ferrite even at the very lowest level. All the obtained information, including thermal analysis and thermodynamic simulation results, allow to identify the deformation mechanisms present during cold drawing and at the delamination process. In addition, the compositional evolution of cementite and ferrite is also clarified by atom probe tomography.

metallurgy & metallurgical engineering
A study on the microstructural evolution of copper/aluminum composite strips fabricated by micro flexible rolling

Chen Wang,Xiaoguang Ma,Linan Ma,Zhengyi Jiang,Mahadi Hasan,Ashraful Islam,Ajab Khan Kasi,Jingwei Zhao,Md Ashraful Islam

DOI: https://doi.org/10.1016/j.matchar.2023.113315

IF: 4.537

2023-09-11

Materials Characterization

Abstract:Copper/aluminum (Cu/Al) composites with multifunctional applications have been extensively applied in a variety of fields. Nevertheless, the formability of Cu/Al composite strips during micro flexible rolling (MFR) has not been fully investigated in the sub-millimetre range. In the present work, the microstructure, mechanical properties and formability of Cu/Al composite strips during MFR were studied. The microstructure of the annealed and rolled specimens were characterized using scanning electron microscope (SEM) and electron backscatter diffraction (EBSD), and the thickness of Cu/Al composite strips with varying thickness (CSVT) was measured by laser scanning microscope. The results show that Cu/Al composite strips annealed at 400 °C exhibit the best ductility, and the CSVT with the best forming quality is obtained when the Cu layer is contact with the upper work roll. In addition, the microstructural evolution in the downward transition zone, thinner zone, upward transition zone and thicker zone with different reduction was discussed. When the plastic strain continues to increase from thicker zone to thinner zone, the intermetallic compounds (IMCs) layer generated during annealing breaks up, and subdivision and further refinement of Al grains occurs during MFR.

materials science, multidisciplinary,metallurgy & metallurgical engineering, characterization & testing
Affecting Structure Characteristics of Rotary Swaged Tungsten Heavy Alloy Via Variable Deformation Temperature

Adéla Macháčková,Ludmila Krátká,Rudolf Petrmichl,Lenka Kunčická,Radim Kocich

DOI: https://doi.org/10.3390/ma12244200

IF: 3.4

2019-12-13

Materials

Abstract:This study focuses on numerical prediction and experimental investigation of deformation behaviour of a tungsten heavy alloy prepared via powder metallurgy and subsequent cold (20 °C) and warm (900 °C) rotary swaging. Special emphasis was placed on the prediction of the effects of the applied induction heating. As shown by the results, the predicted material behaviour was in good correlation with the real experiment. The differences in the plastic flow during cold and warm swaging imparted differences in structural development and the occurrence of residual stress. Both the swaged pieces exhibited the presence of residual stress in the peripheries of W agglomerates. However, the NiCO matrix of the warm-swaged piece also exhibited the presence of residual stress, and it also featured regions with increased W content. Testing of mechanical properties revealed the ultimate tensile strength of the swaged pieces to be approximately twice as high as of the sintered piece (860 MPa compared to 1650 MPa and 1828 MPa after warm and cold swaging, respectively).

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering

The inhibitory effect of 2‐deoxyglucose on insulin receptor autophosphorylation does not depend on known serine phosphorylation sites or other conserved serine residues of the receptor β‐subunit

Residual Stress Distribution in A Copper-Aluminum Multifilament Composite Fabricated by Rotary Swaging

Al-clad Cu Bond Wires for Power Electronics Packaging: Microstructure Evolution, Mechanical Performance, and Molecular Dynamics Simulation of Diffusion Behaviors

Novel approach to optimize the mechanical properties of Cu-Al composite wires

Assembly of a trinuclear metallo-capsule from a tripodal tris(beta-diketone) derivative and copper(II).

Effects of Deformation on the Mechanical Properties of Deformation Processed Ag-20Cu Macro-composite Wires

(Sub)structure Development in Gradually Swaged Electroconductive Bars

Fabrication of a novel high-strength and high-conductivity copper-clad aluminum composite wire

Effect Of Intermediate Annealing On The Interface And Plasticity Of Cu-Ni-Si/Al-Mg-Si Clad Composite Wires

Deformation and Fracture Behavior of Electrocodeposited Alumina Nanoparticle/Copper Composite Films

Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

Stress-Strain Distribution Within Rotary Swaged Tungsten Heavy Alloy

Effects of Cr addition on the microstructural, mechanical and electrical characteristics of Cu–6wt.%Ag microcomposite

Deformation characteristics of metal clad metal Ag-20Cu macro-composite by severe plastic deformation

Texture characteristics and tensile deformation behavior of Cu/Al layered composites prepared by cast-rolling method

The crucial role of accumulated strain and Cu content on the electrical, thermal, tensile, fracture, and microstructure characteristics of Al/Cu multi-layered composites subjected to SPD

Impact of hardening law on the FEM prediction of residual stresses in copper-clad aluminum wires

Studies on wire hot extrusion processes of metals and metal/CNT

High deformation and delamination mechanisms explained through mesoscale and nanoscale phenomena in pearlitic steel wires

A study on the microstructural evolution of copper/aluminum composite strips fabricated by micro flexible rolling

Affecting Structure Characteristics of Rotary Swaged Tungsten Heavy Alloy Via Variable Deformation Temperature