Electrochemical Impedance Monitoring of Copper Damascene Chemistries

Delia Nieto Sanzb,Hung-Ming Chen,S. J. Parulekar,A. Zduneka

Abstract:This paper describes electrochemical impedance spectroscopy (EIS) measurements performed on copper damascene plating chemistries during non-production plating experiments and on process tool baths during copper metallization to characterize changes in the plating bath condition. The results show that the shape of the impedance scan is sensitive to changes in the steady state of the bath chemistry, bleed/feed operation, and process perturbations, and may be an indicator of the overall bath quality. Further development of this method, as an online monitor to track the overall bath quality and its incorporation into a copper bath management and delivery system, are also discussed. Introduction The promising electrical properties and capability to deposit copper into submicron features by superconformal deposition have brought copper electroplating technology into the mainstream of the semiconductor metallization process. However, the ability to perform superconformal deposition of copper in vias and trenches depends strongly on specific organic additives to the copper sulfate/sulfuric acid-based electroplating bath. Achieving a defect-free deposition requires a precise maintenance of the concentrations of additives and additive byproducts. Monitoring or controlling these is therefore crucial to guaranteeing the properties of the copper deposit. The roles of bath ageing and additive degradation are of considerable interest since these can affect the quality of the copper deposit and ultimately influence copper bath chemical management schemes [1]. Additionally, changes in the overall bath quality influenced by manufacturing conditions, additive degradation, and byproduct accumulation, can profoundly affect the copper deposit and these are not presently controlled. State-of-the art copper interconnect plating tools use online monitoring to quantify bath component concentrations to achieve tighter bath control. Presently, bath quality is maintained by bleeding part of the solution about 10% each day. A more quantitative determination of bath quality would enable out-of-spec bath conditions to be readily measured, identified and controlled, and more accurate preventative maintenance performed. While quantifying bath ageing and measuring byproducts has been reported, optimization of bath quality management remains difficult, partly due to the proprietary nature of copper bath formulations [2-4]. Electrochemical impedance spectroscopy (EIS) was proposed as a possible method for following bath quality during wafer processing [1]. Laboratory experiments involving simulated bath ageing revealed that the impedance technique can track copper bath ageing during and after plating [1]. Furthermore, these results appeared to correlate well with deposit morphology and thus maybe a reliable indicator of the overall quality of the bath during plating operation [5]. EIS measurements were also made on plating bath solutions taken from production copper deposition tools at a semiconductor manufacturing fab [6,7]. EIS was able to distinguish between different bath compositions, as well as between different process perturbations. In this paper, impedance measurements were made on copper damascene plating chemistries during non-production plating experiments and on additional process tool baths during copper metallization. The non-production plating experiments allowed out-of-spec bath conditions with recovery back to a steady state to be characterized without manufacturing production constraints and the risk of wafer loss. The production tests were performed to further demonstrate that EIS can detect differences in production bath chemistries including changes attributable to process perturbations and maintenance functions.

Materials Science,Engineering,Chemistry