The effect of static magnetic field on solid–liquid interfacial free energy of Al–Cu alloy system

Chenglin Huang,Sansan Shuai,Pengchuan Wang,Xin Liu,Jiang Wang,Zhongming Ren
DOI: https://doi.org/10.1016/j.scriptamat.2020.06.025
IF: 6.302
2020-10-01
Scripta Materialia
Abstract:<p>The effect of static magnetic field (SMF) on the solid–liquid interfacial free energy of Al–Cu alloy system was experimentally determined by an improved grain boundary groove method. The value of the solid α-Al-liquid Al–Cu system was found to increase from (157.16±14.14) × 10<sup>−3</sup>J•m<sup>−2</sup> to (206.65±18.60) × 10<sup>−3</sup>J•m<sup>−2</sup>, with an increasing rate of 31.5%, while that of the solid CuAl<sub>2</sub>-liquid Al–Cu system decreased by 46.17% from (280.70±25.26) × 10<sup>−3</sup>J•m<sup>−2</sup> to (151.11±13.56) × 10<sup>−3</sup> J•m<sup>−2</sup> with SMF. The influence of SMF on the value of Al-Cu alloy system was explained as the formation of magnetic dipole on the solid-liquid interface, which was supposed to change the surface tension.</p>
materials science, multidisciplinary,nanoscience & nanotechnology,metallurgy & metallurgical engineering
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