Abstract:Accompanied by the increasing electrification and informationization in various devices and equipment, electric circuits (IC) are required to work in complicated and harsh environments. This significantly challenges the reliabilities of interconnections that bear electron current, heat, and mechanical loading. This research focuses on improving the reliability of interconnections serving at high-density current, wide temperature range, and high temperature, by exploring novel materials/techniques including i) $\beta\text{Sn}$ structure and orientation control technique, ii) SnGaX full solid-solution (SS) solder alloys, and iii) Sn-CuNi and Ga-Al transient liquid phase bonding (TLPB) technique. Controlling $\beta\text{Sn}$ structure and orientation is realized by harnessing the $\beta\text{Sn}$ heterogeneous nucleation using seed crystal, and this technique can be applied to Sn-based solder joints to combat reliability problems such as electromigration that is heavily influenced by the $\beta\text{Sn}$ orientation. The SnGaX SS solder is a novel patented material that takes advantage of Ga solid solution strengthening to achieve balanced strength and ductility. As opposed to the typical third-generation Pb-free solder Innolot that is too strong to bear plastic deformation, SnGaX SS solder demonstrates a good thermal cycling performance. Sn-CuNi and Ga-Al TLPB provide new solutions for power electronic assembling and they show good mechanical performance and low cost.

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Selection of Alternative Local Interconnect Metals: Beyond Traditional Criteria Towards Sustainable and Secure Supply Chains

Multi-Objective Optimization for Rapid Identification of Novel Compound Metals for Interconnect Applications

Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects

Modeling of Carbon Nanotube Interconnects and Comparative Analysis with Cu Interconnects

Towards 3-D Carbon-Based Heterogeneous Interconnects

Copper Metallization For Current Very Large Scale Integration

Cu$_x$Al$_{1-x}$ films as Alternatives to Copper for Advanced Interconnect Metallization

Opportunities and Challenges of 2D Materials in Back-End-of-line Interconnect Scaling

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Understanding the Impact of Surface Engineering, Structure, and Design on Electromigration Through Monte Carlo Simulation and In‐Situ SEM Studies

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Interdiffusion reliability and resistivity scaling of intermetallic compounds as advanced interconnect materials

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Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects

Nanocarbon via interconnects

Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization

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Copper Interconnection Technology and Process Reliabilities in VLSI

BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond

Exploring W-Cu Hybrid Dual Damascene Metallization for Future Nodes