A Transient Thermal Model for Power Electronics Systems

Neelakantan Padmanabhan

DOI: https://doi.org/10.1109/SoutheastCon52093.2024.10500091

2024-04-25

Abstract:An equation based reduced order model applicable to generalized heat equation and thermal simulations of power electronics systems developed in commercial CFD tools, is presented in this work. The model considers the physics of heat transfer between multiple objects in different mediums and presents a set of equations that can be applied to a wide range of heat transfer scenarios including conduction, natural and forced convection problems. A few case studies including heat transfer in a power electronic system are simulated in Ansys Icepak and the temperatures from the simulations are compared with the temperatures predicted by the models. The models are observed to be highly accurate when compared with the simulations. The predictive model described in this work reduces large complex simulations down to a few parameters which tremendously improves the computation speed, uses very low physical disk space and enables fast evaluation of thermal performance of the system for any changes in the input parameters.

Numerical Analysis

What problem does this paper attempt to address?

The paper attempts to address the problem of developing a transient thermal model in power electronic systems to improve the computational efficiency and accuracy of thermal simulations. Specifically, the paper proposes a simplified model based on equations, suitable for general heat conduction equations and thermal simulations in commercial CFD tools. This model considers the physics of heat transfer between multiple objects in different media and provides a set of equations that can be used for a wide range of heat transfer scenarios, including conduction, natural convection, and forced convection problems.

The core objective of the paper is to reduce the number of parameters required for large and complex simulations, thereby significantly increasing computational speed, using very low physical disk space, and quickly evaluating the thermal performance of the system when input parameters change. Additionally, the model demonstrates extremely high accuracy when compared to detailed simulation results. This approach is of great significance for the iterative design improvement process of power electronic systems.