Abstract:Simultaneously guiding electromagnetic waves and heat flow at any incidence angle to smoothly bypass some electromagnetic/thermal sensitive elements is a key factor to ensure efficient communication and thermal protection for an on-chip system. In this study, an omnidirectional on-chip electromagnetic-thermal cloak is proposed. Firstly, a holey metallic plate with periodic array of subwavelength apertures is designed by optical surface transformation to realize an omnidirectional electromagnetic cloaking module for on-chip electromagnetic signal. Secondly, a two-layer ring-shaped engineered thermal structure is designed by solving Laplace equation to realize an omnidirectional thermal cloaking module for in-chip heat flow. Finally, these two cloaking modules are combined elaborately to achieve cloaking effect for both the electromagnetic waves and thermal fields simultaneously from any detecting direction, thus protecting the build-in electromagnetic/thermal sensitive elements without disturbing the external electromagnetic/thermal signal. The proposed electromagnetic-thermal cloak may have potential advantage in dealing with omnidirectional electromagnetic compatibility/shielding and multi-directional thermal management/dissipation of an on-chip system.

What problem does this paper attempt to address?

This paper aims to address the issues of electromagnetic compatibility and thermal management in highly integrated chip systems. Specifically, the study proposes an on-chip omnidirectional electromagnetic-thermal cloak capable of simultaneously guiding electromagnetic waves and smoothly bypassing sensitive components on the chip at any incident angle. ### Research Background and Objectives With the development of intelligent technologies, applications such as advanced driver-assistance systems require strictly enclosed internal components to achieve good thermal management and electromagnetic interference (EMI) shielding conditions. For almost all highly integrated chip circuits and intelligent systems, it is necessary to solve the problems of electromagnetic compatibility and thermal management. Current research mainly focuses on finding new composite materials with good thermal conductivity and EMI shielding performance. However, with the development of metamaterials, many new artificial structures have more advantages in controlling electromagnetic waves and heat flow compared to traditional composite materials. ### Main Contributions 1. **Design of the Electromagnetic Cloaking Module**: A perforated metal plate was designed through optical surface transformation, which includes periodically arranged sub-wavelength holes, achieving omnidirectional electromagnetic cloaking on the chip. 2. **Design of the Thermal Cloaking Module**: A double-layer annular engineered thermal structure was designed by solving the Laplace equation, achieving omnidirectional thermal cloaking within the chip. 3. **Implementation of the Integrated Cloak**: The above two cloaking modules were cleverly combined to achieve simultaneous cloaking effects for electromagnetic waves and parallel thermal fields, protecting the embedded electromagnetic/thermally sensitive components from external electromagnetic/thermal signals. ### Application Prospects The proposed electromagnetic-thermal cloak is expected to have potential advantages in addressing omnidirectional electromagnetic compatibility/shielding and multidirectional thermal management/heat dissipation issues in chip systems, which is crucial for improving the performance of highly integrated chip systems. Additionally, the cloak uses only natural materials (copper and polystyrene foam), making it more feasible for practical chip applications.

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