Properties of Nb\_xTi\_{(1-x)}N thin films deposited on 300 mm silicon wafers for upscaling superconducting digital circuits

Daniel Pérez Lozano,Jean-Philippe Soulié,Blake Hodges,Xiaoyu Piao,Sabine O'Neal,Anne-Marie Valente-Feliciano,Quentin Herr,Zsolt Tőkei,Min-Soo Kim,Anna Herr
2023-11-17
Abstract:Scaling superconducting digital circuits requires fundamental changes in the current material set and fabrication process. The transition to 300 mm wafers and the implementation of advanced lithography are instrumental in facilitating mature CMOS processes, ensuring uniformity, and optimizing the yield. This study explores the properties of NbxTi(1-x)N films fabricated by magnetron DC sputtering on 300 mm Si wafers. As a promising alternative to traditional Nb in device manufacturing, NbxTi(1-x)N offers numerous advantages, including enhanced stability and scalability to smaller dimensions, in both processing and design. As a ternary material, NbxTi(1-x)N allows engineering material parameters by changing deposition conditions. The engineered properties can be used to modulate device parameters through the stack and mitigate failure modes. We report characterization of NbxTi(1-x)N films at less than 2% thickness variability, 2.4% Tc variability and 3% composition variability. The films material properties such as resistivity (140-375 {\Omega}cm) and critical temperature Tc (4.6 K - 14.1 K) are correlated with stoichiometry and morphology of the films. Our results highlight the significant influence of deposition conditions on crystallographic texture along the films and its correlation with Tc.
Superconductivity
What problem does this paper attempt to address?
This paper aims to solve the problems of materials and manufacturing processes encountered in the scaling - up of superconducting digital circuits. Specifically, the current superconducting digital circuit technology is limited in terms of feature size, number of process layers, power distribution, and fault - mode mitigation, etc. These limitations are partly due to the use of niobium (Nb) as the base material. Although niobium has the highest critical temperature among all elemental superconductors, its critical temperature will decrease after annealing, which limits the thermal budget in multi - metal - layer integration and prevents the use of the back - end - of - line (BEOL) integration procedures in common CMOS technologies. To overcome these problems, this research explored the properties of Nb\(_x\)Ti\((1 - x)\)N thin films prepared by DC magnetron sputtering on 300 - mm silicon wafers. As an alternative material, Nb\(_x\)Ti\((1 - x)\)N shows many advantages in device manufacturing, such as enhanced stability and the ability to be scaled down to smaller sizes. In addition, this ternary material allows the adjustment of material parameters by changing the deposition conditions, thereby adjusting device parameters and mitigating fault modes. The research focused on evaluating the uniformity and performance optimization of Nb\(_x\)Ti\((1 - x)\)N thin films, especially those with a thickness variation of less than 2%, a critical temperature \(T_c\) variation of less than 2.4%, and a composition variation of less than 3%. The research results show that the deposition conditions have a significant impact on the crystallographic texture of the thin films, and the crystallographic texture is closely related to the critical temperature. Through this research, the authors demonstrated the possibility of preparing high - performance Nb\(_x\)Ti\((1 - x)\)N thin films on 300 - mm silicon wafers, providing a new approach for the large - scale integration and optimization of superconducting digital circuits.