High Density Fabrication Process for Single Flux Quantum Circuits

D. Yohannes,M. Renzullo,J. Vivalda,A. C. Jacobs,M. Yu,J. Walter,A. F. Kirichenko,I. V. Vernik,O. A. Mukhanov

DOI: https://doi.org/10.1063/5.0152552

2023-06-19

Abstract:We implemented, optimized and fully tested over multiple runs a superconducting Josephson junction fabrication process tailored for the integrated digital circuits that are used for control and readout of superconducting qubits operating at millikelvin temperatures. This process was optimized for highly energy efficient single flux quantum (ERSFQ) circuits with the critical currents reduced by factor of ~10 as compared to those operated at 4.2 K. Specifically, it implemented Josephson junctions with 10 uA unit critical current fabricated with a 10 uA/um2 critical current density. In order to circumvent the substantial size increase of the SFQ circuit inductors, we employed a NbN high kinetic inductance layer (HKIL) with a 8.5 pH/sq sheet inductance. Similarly, to maintain the small size of junction resistive shunts, we used a non-superconducting PdAu alloy with a 4.0 ohm/sq sheet resistance. For integration with quantum circuits in a multi-chip module, 5 and 10 um height bump processes were also optimized. To keep the fabrication process in check, we developed and thoroughly tested a comprehensive Process Control Monitor chip set.

Superconductivity,Applied Physics

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to achieve high - density manufacturing of single - flux - quantum (SFQ) circuits in an extremely low - temperature environment. Specifically, the authors have developed an optimized superconducting Josephson Junction manufacturing process for integrated digital circuits used to control and read out superconducting qubits. This process is particularly suitable for highly energy - efficient extreme single - flux - quantum (ERSFQ) circuits, whose critical current is reduced by approximately 10 times when operating at temperatures below 4.2 K. To overcome the problem of a significant increase in the size of SFQ circuit inductors, the researchers adopted an NbN high - kinetic - inductance layer (HKIL) with a sheet resistance of 8.5 pH/sq. Meanwhile, in order to keep the small size of the junction - resistance shunt, a non - superconducting PdAu alloy with a sheet resistance of 4.0 ohm/sq was used. In addition, to integrate with quantum circuits in multi - chip modules, the bump processes with heights of 5 μm and 10 μm were also optimized. To monitor the manufacturing process, the research team developed and thoroughly tested a comprehensive set of process - control - monitoring chip sets.

In short, this research aims to solve the problems of low integration and high energy consumption of SFQ circuits in an extremely low - temperature environment by introducing new materials and technologies, thereby promoting the development of quantum - computing technology.