Abstract:We propose a new model for pattern formation in peeling of an adhesive tape based on the equation of motion for the displacement of deformed adhesives in the peel front. The spatiotemporal patterns obtained from the model are consistent with those from previous models and experiments. Moreover, dynamical and statistical properties of the patterns are investigated.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the modeling and understanding of the spatio - temporal patterns formed during the peeling of adhesive tapes. Specifically, the author proposes a new model based on the displacement motion equation of the deformed adhesive at the peeling front, which is used to describe the spatio - temporal pattern formation during the peeling process. This model aims to explain and predict the different morphologies that appear on the peeling surface of the adhesive tape at different peeling speeds, especially the distribution and conversion mechanisms of the two peeling states with or without the tunnel structure. The paper mentions that the peeling speed and the stiffness of the system are the main factors controlling the spatio - temporal pattern formation. By introducing asymmetric local dynamics rather than spatial interactions to distinguish between the two peeling states, the author constructs a new model that can describe the dynamic behavior of the peeling adhesive tape. In addition, the model also takes into account the viscoelastic properties of the adhesive, which helps to more accurately simulate the mechanical behavior in the actual peeling process. Through numerical simulation, this model successfully reproduces the spatio - temporal pattern characteristics observed in previous studies, such as the change in the proportion of black and white areas, the conversion of connectivity, and the phenomenon that the proportion of white areas monotonically decreases as the peeling speed increases. These results not only verify the effectiveness of the model, but also provide a theoretical basis for further exploring the complex dynamic behavior during the peeling process.

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