Abstract:The adoption of 3D packaging technology necessitates the development of new approaches to failure electronic device analysis. To that end, our team is developing a tool called the quantum diamond microscope (QDM) that leverages an ensemble of nitrogen vacancy (NV) centers in diamond, achieving vector magnetic imaging with a wide field-of-view and high spatial resolution under ambient conditions. Here, we present the QDM measurement of 2D current distributions in an 8-nm flip chip IC and 3D current distributions in a multi-layer PCB. Magnetic field emanations from the C4 bumps in the flip chip dominate the QDM measurements, but these prove to be useful for image registration and can be subtracted to resolve adjacent current traces in the die at the micron scale. Vias in 3D ICs display only Bx and By magnetic fields due to their vertical orientation and are difficult to detect with magnetometers that only measure the Bz component (orthogonal to the IC surface). Using the multi-layer PCB, we show that the QDM's ability to simultaneously measure Bx, By, and Bz is advantageous for resolving magnetic fields from vias as current passes between layers. We also show how spacing between conducting layers is determined by magnetic field images and how it agrees with the design specifications of the PCB. In our initial efforts to provide further z-depth information for current sources in complex 3D circuits, we show how magnetic field images of individual layers can be subtracted from the magnetic field image of the total structure. This allows for isolation of signal layers and can be used to map embedded current paths via solution of the 2D magnetic inverse. In addition, the paper also discusses the use of neural networks to identify 2D current distributions and its potential for analyzing 3D structures.

Three-dimensional imaging of integrated-circuit activity using quantum defects in diamond

Three-dimensional imaging of integrated-circuit activity using quantum defects in diamond

Vector Magnetic Current Imaging of an 8 nm Process Node Chip and 3D Current Distributions Using the Quantum Diamond Microscope

Nitrogen-Vacancy Centers in Diamond for Current Imaging at the Redistributive Layer Level of Integrated Circuits

Magnetic Field Fingerprinting of Integrated Circuit Activity with a Quantum Diamond Microscope

3D‐Mapping and Manipulation of Photocurrent in an Optoelectronic Diamond Device

Imaging circuits in three dimensions

3D-mapping and manipulation of photocurrent in an optoelectronic diamond device

Imaging current paths in silicon photovoltaic devices with a quantum diamond microscope

High speed microcircuit and synthetic biosignal widefield imaging using nitrogen vacancies in diamond

Fault Localization in a Microfabricated Surface Ion Trap using Diamond Nitrogen-Vacancy Center Magnetometry

Quantum enhanced electric field mapping within semiconductor devices

Current Paths in an Atomic Precision Advanced Manufactured Device Imaged by Nitrogen-Vacancy Diamond Magnetic Microscopy

Spatial mapping of band bending in semiconductor devices using in-situ quantum sensors

Diamond Micro-Chip for Quantum Microscopy

Directly Revealing the Electrical Annealing of Nanoscale Conductive Networks with Solid Spins

High-Resolution Short-Circuit Fault Localization in a Multi-Layer Integrated Circuit using a Quantum Diamond Microscope

Surface H‐field mapping of a GaAs single pole double throw switch chip based on quantum diamond probe

Photoelectrical imaging and coherent spin-state readout of single nitrogen-vacancy centers in diamond

Nanoscale Imaging of Current Density with a Single-Spin Magnetometer

Nanoscale Electric Field Imaging with an Ambient Scanning Quantum Sensor Microscope