A high entropy alloy as very low melting point solder for advanced electronic packaging

Yingxia Liua,Li Pu,Yong Yang,Quanfeng He,Ziqing Zhou,Chengwen Tan,Xiuchen Zhao,Qingshan Zhang,K. N. Tu

DOI: https://doi.org/10.48550/arXiv.2006.01345

2020-06-02

Abstract:SnBiInZn based high entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 oC. The wetting angle is about 52o after reflow at 100 oC for 10 min. The interfacial intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol, however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for bio-medical devices.

Applied Physics,Materials Science

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to develop a high - entropy alloy (HEA) solder with a low melting point (about 80°C) in advanced electronic packaging technologies. Currently, as Moore's Law is approaching its end in silicon chip technology, electronic packaging technology has become crucial to sustain the future computing growth of the microelectronics industry. In particular, for the vertical stacking technology of three - dimensional integrated circuits (3D IC), solders with different melting points are required to achieve the stacking and integration of different components. However, at present, the choices for low - melting - point solders are limited, especially for the applications of biomedical devices. The operating temperatures of these devices are close to body temperature, so solders with lower reflow temperatures (such as around 100°C) are required.

The paper mentions that the existing low - melting - point solder, such as eutectic SnBi, has a melting point of 138°C and a soldering temperature of about 150°C, which is still relatively high. In order to further reduce the soldering temperature, the research team has developed a high - entropy alloy solder based on SnBiInZn, which has a melting point of about 80°C and a soldering temperature of about 100°C. This new - type solder has good wetting properties and a low growth rate of interfacial intermetallic compounds (IMC), showing potential application value in advanced electronic packaging technologies, especially in the field of biomedical devices.