Enhanced reliability through regulation of electrode resistance in indium tin oxide/HfO /TiN resistive memories
Chuang Li,Wenxi Li,Fang Wang,Jingwei Zhang,Jingsi Sun,Jiaqiang Shen,Kai Hu,Jinshi Zhao,Kailiang Zhang
DOI: https://doi.org/10.1016/j.mssp.2020.105103
IF: 4.1
2020-09-01
Materials Science in Semiconductor Processing
Abstract:<p>In this work, three indium tin oxide (ITO) films with distinct resistance values were realized by optimizing the deposition process, and X-ray photoelectron spectroscopy was performed to confirm the origin of resistance variation in the different ITO films. Three ITO/HfO<sub><em>x</em></sub>/TiN (IHT) devices were correspondingly constructed by capping the distinct ITO films applied as a top electrode. A series of reliability measures indicated that the IHT stack capping ITO films with high resistance value (<em>R</em><sub>TE</sub>, ~600 Ω) demonstrated better performance. For example, endurance of up to 10<sup>5</sup> sweep cycles, compared with other stacks capping ITO films with low <em>R</em><sub>TE</sub> (~300 Ω or 50 Ω). Furthermore, the Schottky emission mechanism was confirmed through fitting of I-V-curves in the HRS, and the carrier conduction was determined primarily by an Ohmic mechanism in the LRS.</p>
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied