Effects of Pulling Rate on Metal Impurity Removal During Si Refining in Ti-90 Wt.% Si Alloy Directional Solidification
Jingfei Hu,Kuisong Zhu,Kuixian Wei,Wenhui Ma,Tianlong Lv
DOI: https://doi.org/10.1016/j.jallcom.2019.152621
IF: 6.2
2020-01-01
Journal of Alloys and Compounds
Abstract:To analyze the effects of pulling rate on the removal of impurities from a Ti-90 wt% Si alloy during the Si refining process, five samples with different pulling rates were examined. At a low pulling rate, the contents of Fe, Al, and Ca could be reduced to 9 × 10−4 wt%, 21 × 10−4 wt%, and 10 × 10−4 wt%, representing impurity removal rates of 99.68%, 98.76%, and 95%, respectively. Under our experimental conditions, we determined that a pulling rate of 5 μm/s can reduce the time taken for directional solidification and provide excellent impurity removal efficiency. The average impurity removal rates for Fe, Al, and Ca in the silicon enrichment layer were 98.431%, 99.262%, and 85.833%, respectively. The migration and removal mechanism of Fe during the directional solidification refining process was also identified. Due to the low energy of grain boundary segregation of impurities, Fe segregate at the grain boundary of TiSi2 grains, such that Fe eventually forms FeTiSi2 with TiSi2 at the grain boundary. The analysis of our study provides theoretical and experimental support for the purification of polycrystalline silicon from Ti–Si alloys, which further broadens the application of Ti–Si alloys and lays the foundation for comprehensive utilization of high-titanium blast furnace slag.