Metallographic phase grinding sample pressure adjusting device and metallographic phase grinding and polishing device and method

田勇,王昭东,韩毅,郝浩腾,李勇,邓想涛,王丙兴
2016-06-29
Abstract:The invention relates to the technical field of metallographic phase grinding, in particular to a metallographic phase grinding sample pressure adjusting device and a metallographic phase grinding and polishing device and method. The metallographic phase grinding sample pressure adjusting device comprises a fixed rod, a rotary connection rod and a sample clamping mechanism which are all sequentially connected; the sample clamping mechanism comprises an adjusting sleeve, a pin shaft arranged in the adjusting sleeve, a fastener installed at the upper end of the pin shaft, a spring arranged on the pin shaft in a sleeving manner and pressed in the adjusting sleeve through the pin shaft, and a sample clamping sleeve detachably installed at the lower end of the pin shaft and used for clamping a metallographic phase sample. The metallographic phase grinding and polishing device comprises the metallographic phase grinding sample pressure adjusting device, a cushion plate, a grinding and polishing disk and a motor. During grinding and polishing, firstly, pressure is preset, and then by adjusting the fastener of the pin shaft to be connected with the adjusting sleeve, the pressure is loaded onto the metallographic phase sample. According to the metallographic phase grinding sample pressure adjusting device and the metallographic phase grinding and polishing device and method, one or more metallographic phase samples can be pre-ground and polished on the same equipment, and pressure acting on the samples is adjustable and can be automatically released.
Engineering,Materials Science
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