Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Pardeep Shahi,Ali Heydari,Bahareh Eslami,Vahideh Radmard,Chandraprakash Hinge,Himanshu Modi,Lochan Sai Reddy Chinthaparthy,Mohammad Tradat,Dereje Agonafer,Jeremy Rodriguez
DOI: https://doi.org/10.1115/1.4065948
2024-07-17
Journal of Electronic Packaging
Abstract:Abstract Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of things, etc. This led to an unprecedented growth in transistor density for high-end CPUs and GPUs, creating thermal design power (TDP) of even more than 700 watts for some of the NVIDIA existing GPUs. Cooling these high TDP chips with air cooling comes with a cost of the higher form factor of servers and noise produced by server fans close to the permissible limit. Direct-to-chip cold plate-based liquid cooling is highly efficient and becoming more reliable as the advancement in technology is taking place. Several components are used in the liquid-cooled data centers for the deployment of cold plate based direct to chip liquid cooling like cooling loops, rack manifolds, CDUs, row manifolds, quick disconnects, flow control valves, etc. Row manifolds used in liquid cooling are used to distribute secondary coolant to the rack manifolds. Characterizing these row manifolds to understand the pressure drops and flow distribution for better data center design and energy efficiency is important. In this paper, the methodology is developed to characterize the row manifolds. Water-based coolant Propylene glycol 25% was used as the coolant for the experiments and experiments were conducted at 21 °C coolant supply temperature. Two, six-port row manifolds' P-Q curves were generated, and the value of supply pressure and the flow rate were measured at each port. The results obtained from the experiments were validated by a technique called Flow Network Modeling (FNM). FNM technique uses the overall flow and thermal characteristics to represent the behavior of individual components.
engineering, mechanical, electrical & electronic