Crack initiation of printed lines predicted with digital image correlation

C. Katsarelis,O. Glushko,C.Tonkin,M.S. Kennedy,M. J. Cordill

DOI: https://doi.org/10.1007/s11837-018-2969-y

2019-04-09

Abstract:Printing of metallic films has been preferred for roll-to-roll processes over vacuum technologies due to faster processing times and lower processing costs. Films can be produced by depositing inks containing suspended metallic particles within a solvent and then heating the films to both remove the solvent and sinter the particles. The resulting printed structure, electrical and mechanical behavior of the printed films has been studied to better understand their electro-mechanical response to loading and eventual brittle fracture. This study evaluated the electro-mechanical behavior of 1.25 {\mu}m printed Ag films using in-situ resistance and in-situ imaging methods. Digital image correlation was utilized with confocal laser scanning microscope images to better visualize crack initiation during tensile straining. This technique showed that cracks initiated earlier in the thicker areas of the film (crests) than in lower areas (troughs) because of a higher density of printing defects and the increased thickness.

Applied Physics

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to predict and analyze the crack initiation behavior of printed lines (especially 1.25 µm - thick silver films) during tensile strain by combining digital image correlation (DIC) technology with confocal laser scanning microscopy (CLSM) images. Specifically, the research focuses on the following points:

1. **Crack Initiation and Propagation**: By using DIC technology in combination with CLSM images, researchers can more accurately observe the initiation positions and propagation paths of cracks in different thickness regions (peaks and valleys). The study found that cracks appear earlier in thicker regions (peaks), mainly because these regions contain a higher density of printing defects and greater thickness.

2. **Correlation between Electrical and Mechanical Behaviors**: The research also explored the relationship between the local mechanical behavior of the printed film and its global electrical behavior. By monitoring the resistance change during the stretching process, the researchers found that the change in resistance is closely related to the initiation and development of cracks.

3. **Effect of Surface Roughness**: The high surface roughness of the printed lines not only affects crack initiation but also provides a natural contrast pattern for the application of DIC technology, making it possible to measure local strain. The study shows that there are more high - strain regions at the peaks, which leads to more crack initiation points.

4. **Optimization of Processing Technology**: Based on the above findings, the researchers suggest that the number of crack initiation points can be reduced by reducing the surface amplitude and printing defects, thereby indirectly reducing the electrical performance degradation caused by strain.

Through these studies, the author hopes to provide new insights and technical support for the manufacturing of flexible electronic devices, especially in terms of improving the reliability of materials and prolonging their service life.