Abstract:Cracks are Janus-faced, which cause material failure on one hand and serve as a powerful approach for material processing on the other. To predict cracks and control them in a desired manner, foundational fracture mechanisms are continuously being pursued, based on simplified modes of planar cracks. In reality, cracks usually occur in a three-dimensional (3D) irregular manner. Prediction of 3D fractures is of particular significance for understanding the fundamental fracture mechanisms. However, controlling cracks in typical 3D modes is rare. Here we report that controllable 3D helical cracks on heterogeneous spindle knots are induced by biaxial thermal stresses. The thermal expansion mismatch between the tough core and brittle shell during the heating process generates biaxial stresses in the axial and circumferential directions. Surface cleavage and interface delamination driven by the release rate of elastic strain energy are harmonized due to the unique spindle geometry and cooperate to produce a 3D helical crack. This finding is helpful for understanding complex cracking mechanisms and provides a promising prospect for controlling or eliminating 3D cracks. Materials are prone to crack under stress — this can either cause materials failure or, when deliberately induced, offer a useful manufacturing step. In both situations, knowing how to control and predict how materials crack will help in their design and synthesis. Yet exerting control is difficult — for example, we have all seen pottery cracked along random directions. Yong Zhao and co-workers have now prepared core–shell fibres that undergo helical cracking at specific positions. A tough glass fibre was dip-coated with a brittle metal oxide film featuring regular spindle knots. On calcination, the thermal expansion undergone by the tough core does not match that of the brittle shell, creating longitudinal and circumferential stresses. The stress lines in turn cause the knots to crack into helical coils, whose shapes depend on the initial formation process. These findings represent a step forward along the way of controllable fracture. Regular microhelics on a heterogenous spindle knot are obtained by controlled biaxial stresses in three dimensions. The spindle knot has a tough core and a brittle shell, resulting in biaxial stresses that arise from a thermal expansion mismatch during a heating process. Surface cleavage and interface delamination are harmonized due to the special spindle geometry and cooperate to 3D helical crack. This study not only widens our understanding of the cracking phenomena, but also sheds light on the control and design of regular cracks in arbitrary dimensions. It holds promise for applications in eliminating or controlling cracks for manufacturing process, especially at micro/nanosales, which domains are difficult to be generated by routine methods.

Hierarchical Crack Patterns of Metal Films Sputter Deposited on Soft Elastic Substrates.

Hierarchical Wrinkles and Oscillatory Cracks in Metal Films Deposited on Liquid Stripes.

Ordered Ring-Shaped Cracks Induced by Indentation in Metal Films on Soft Elastic Substrates

Recent progress on crack pattern formation in thin films

Recent Progress on Crack Pattern Formation in Thin Films.

Localization of Wrinkle Patterns by Crack-Tip Induced Plasticity: Experiments and Simulations

Direct observation on the surface fracture of ultrathin film double-network hydrogels

Tunable Formation of Ordered Wrinkles in Metal Films with Controlled Thickness Gradients Deposited on Soft Elastic Substrates.

Peeling from a patterned thin elastic film

In-situ observation of crack propagation through the nucleation of nanoscale voids in ultra-thin, freestanding Ag films

From Chaos to Control: Programmable Crack Patterning with Molecular Order in Polymer Substrates

Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks

Microfabrication through Self‐Ordering of Cracks: Mechanism, Upscaling and Application for Transparent Electrodes

Self-replicating cracks: a collaborative fracture mode in thin films

Selective crack suppression during deformation in metal films on polymer substrates using electron beam irradiation

How Cracks Induced by Straining Influence the Tribological Properties of Mo Films Deposited on Polyimide Substrates

Study on the Crack Propagation of Stiff-Thin-Film-on-Soft-Substrate Structures under Biaxial Loading

Controlled Wrinkling Patterns in Periodic Thickness-Gradient Films on Polydimethylsiloxane Substrates

Biaxial Stress Controlled Three-Dimensional Helical Cracks

Hierarchical Multi-Scale Modelling of Plasticity of Submicron Thin Metal Films

Formation of Wavy Crack Morphology in Silicon Oxide Films Due to Collaborative Interface Debonding