Abstract:We have designed and tested a robust 20 $\times$ 20 cm$^2$ thin metal film internal anode capacitively coupled to an external array of signal pads or micro-strips for use in fast microchannel plate photodetectors. The internal anode, in this case a 10nm-thick NiCr film deposited on a 96% pure Al$_2$O$_3$ 3mm-thick ceramic plate and connected to HV ground, provides the return path for the electron cascade charge. The multi-channel pickup array consists of a printed-circuit card or glass plate with metal signal pickups on one side and the signal ground plane on the other. The pickup can be put in close proximity to the bottom outer surface of the sealed photodetector, with no electrical connections through the photodetector hermetic vacuum package other than a single ground connection to the internal anode. Two pickup patterns were tested using a small commercial MCP-PMT as the signal source: 1) parallel 50$\Omega$ 25-cm-long micro-strips with an analog bandwidth of 1.5 GHz, and 2) a 20 $\times$ 20 cm$^2$ array of 2-dimensional square `pads' with sides of 1.27 cm or 2.54 cm. The rise-time of the fast input pulse is maintained for both pickup patterns. For the pad pattern, we observe 80% of the directly coupled amplitude. For the strip pattern we measure 34% of the directly coupled amplitude on the central strip of a broadened signal. The physical decoupling of the photodetector from the pickup pattern allows easy customization for different applications while maintaining high analog bandwidth.

Anode current saturation of ALD-coated Planacon MCP-PMTs

Large-area, high-resolution atomic layer deposited microchannel plates for UV imaging and particle identification in space science applications

Single Electron Charge Spectra of 8-Inch MCP-PMTs Coated by Atomic Layer Deposition

Theoretical and experimental investigation of secondary electron emission characteristics of ALD-ZnO conductive films

Realization of neutron sensitive MCP with ALD technique

TCT investigation of the one-sided depletion of low-temperature covalently bonded silicon sensor P-N diodes

Capacitively coupled pickup in MCP-based photodetectors using a conductive metallic anode

Effect of TaN buffer layer on the sensitivity of ASIC-integrated AMR sensors

Monitor of the Chamber Wall Condition in Plasma Etching Process by APM Sensor

Design and test results of different aluminum coating layers on the sCMOS sensors for soft X-ray detection

Single electron charge spectra of 8-inch high-collection-efficiency MCP-PMTs

High-speed InAlAs digital alloy avalanche photodiode

Detection and Analysis of Anodic Current Transients Associated with Nanoscale Β-Phase Precipitates on an Al–Mg Microelectrode

Neutron Detector Design Based on ALD Coated MCP

Uneven Stripping Behavior, A killer of Mg Anode in Mist

R&D of ultra-fast 8 × 8 anodes MCP-PMT

Characteristics of Thin InAlAs Digital Alloy Avalanche Photodiodes.

Study of Built-in Amplifier Performance on HV-CMOS Sensor for the ATLAS Phase-Ii Strip Tracker Upgrade

The Effect of Inductively Coupled Plasma Etching on the I–V Curves of the Avalanche Photodiode with GaN/AlN Periodically Stacked Structure

Electrical/piezoresistive effects in bent Alpide MAPS

Observations of Anomalies in the Anodic Behaviour of Microcrystalline Aluminium