Abstract:A strategy combining structural interlocking and polymer bridging is designed by introducing subsurface‐initiated atom transfer radical polymerization to strengthen the adhesion of "rigid‐soft" interfaces. Typically, the adhesive strength between the Cu and PDMS elastomers is much higher than that fabricated by only polymer bridging. Thus, the as‐fabricated 3D compressible Cu sponges significantly improve the performance of piezoresistive pressure sensors. The interface adhesion plays a key role between rigid metal and elastomer in compressible and stretchable conductors. However, the poor interfacial adhesion hinders their wide applications. To strengthen the interface adhesion, herein, a combination strategy of structure interlocking and polymer bridging is designed by introducing a method of subsurface‐initiated atom transfer radical polymerization (sSI‐ATRP). This method can make polymer brush root in polydimethylsiloxane (PDMS) subsurface, on this basis, metals further grow from subsurface to surface of PDMS via electroless deposition. As a result, the adhesive strength (≈2.5 MPa) between metal layer and PDMS elastomer is 4 times higher than that made by common polymer modification. As a demonstration, pressure sensor is constructed by using as‐prepared compressible 3D Cu sponge as a top electrode and paper‐based interdigited metal electrode as a bottom electrode. The device sensitivity can reach up to 961.2 kPa−1 and the durability can arrive at 3 000 cycles without degradation. Thus, this proposed interface‐enhancement strategy for rigid‐soft materials can significantly promote the performance of piezoresistive pressure sensors based on 3D conductive sponge. In the future, it would also be expanded to the fabrication of stretchable conductors and extensively applied in other flexible and wearable electronics.

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