3D Technologies for Large Area Trackers

G. Deptuch,U. Heintz,M. Johnson,C. Kenney,R. Lipton,M. Narian,S. Parker,A. Shenai,L. Spiegel,J. Thom,Z. Ye

DOI: https://doi.org/10.48550/arXiv.1307.4301

2013-07-16

Abstract:We describe technologies which can be developed to produce large area, low cost pixelated tracking detec- tors. These utilize wafer-scale 3D electronics and sensor technologies currently being developed in industry. This can result in fully active sensor/readout chip tiles which can be assembled into large area arrays with good yield and minimal dead area. The ability to connect though the bulk of the device can also provide better electrical performance and lower mass.

Instrumentation and Detectors,High Energy Physics - Experiment

What problem does this paper attempt to address?

This paper aims to explore and develop technologies applicable to large - area tracking detectors, especially using large - scale 3D electronics and sensor technologies to produce low - cost, large - area pixelated tracking detectors. These technologies can enable the assembly of fully - active sensor/read - out chip tiles to form large - area arrays with good yields and minimal dead areas. Connection through the silicon body can also provide better electrical performance and lower mass.

Specifically, the problems that the paper attempts to solve include:

1. **High - luminosity and large - data - volume challenges**: In the next - generation collider experiments, detectors will face unprecedented luminosity and data - volume challenges. Therefore, it is necessary to construct large - area (hundreds of square meters) high - pixel - density detectors with minimal dead areas and reasonable costs.

2. **Limitations of existing technologies**:
- **Edge - space requirements**: Current pixel - sensor arrays are limited by the space requirements at the edges of the detectors to reduce the electric field near the cutting areas, which, as charge - emission sources, may cause excessive current in the edge strips.
- **Grain size of read - out integrated circuits (ROIC)**: Determined by grain yield and mask area.
- **Requirements for edge positions**: For wire bonding to connect with ROIC.

3. **Cost and yield**: The existing fine - pitch bump - bonding technology requires placing chips on sensors individually and then performing a fusion - welding cycle, which is not only costly but also has a complex process. The paper explores wafer - level interconnect technologies, which are expected to reduce interconnect costs, increase interconnect density, and reduce interconnect mass.

To overcome the above problems, the paper proposes several key technologies, including 3D circuits, active - edge sensors, oxide - bonding and interconnect technologies, and large - area assembly methods based on these technologies. Through the combination of these technologies, large - area, high - performance, low - cost pixelated detector modules can be realized.