First Results of the New Endcap TOF Commissioning at BESIII
Z. Wu,S. Sun,Y. Heng,X. Wang,Y. Sun,C. Li,Z. Liu,H. Dai,J. Zhang,P. Cao,W. Sun,S. Wang,Y. Wang,X. Ji,J. Zhao,W. Gong,M. Chen,M. Ye,Y. Qiu,X. Ma,M. Xu,X. Luo,J. Li,R. Yang,F. An,Q. An,X. Jiang,Zhen-an Liu,S. Liu,K. Zhu
DOI: https://doi.org/10.1088/1748-0221/11/07/c07005
2016-01-01
Journal of Instrumentation
Abstract:The upgrade of the current BESIII Endcap TOF (ETOF) is carried out with Multi-gap Resistive Plate Chamber (MRPC) technology. The installation of the new ETOF has been finished in October 2015. The first results of the MRPCs commissioning at BESIII are reported in this paper.