Abstract:The development of a material with high ampacity to allow current to flow through narrow channels is one of the most promising ways to address the progressive miniaturization and light weight of electronic devices. The efficient synergistic electron transmission by compounding 1D/2D carbon materials with a metal matrix via various methods in recent years has attracted great research interest due to their potential utilization in electronics. In this study, a copper (Cu) matrix with a 3D nitrogen (N) doped-multi-walled carbon nanotubes (MCNTs) interface with prominent physical features is reported and fabricated, involving the use of nano-self-assembly-heat-modification by adopting polyethyleneimine-nano-Cu and carboxyl MCNTs. Young's modulus was enhanced from 28.8 to 92.2 GPa due to a higher efficiency of stress transfer and interfacial adhesion, and the hardness fitted by Gauss distribution was increased by ∼69% (∼39.7 HRC). Toward the stability after a modification of vacuum reduction sintering, the initial oxidation temperature (Td) was increased largely from 232 °C to 286 °C, and thermal conductivity was enhanced eminently from 358 to 548 W/(m K) due to more efficient electron/phonon motion. Moreover, synergistic electron transmission endowed the final Cu-N-CNTs with a higher ampacity (7.23–16.98 × 104 A cm−2), which could be further observed by the time-evolution of electrical resistivity under a constant current density. The improved physical features state that the assembled 3D N-CNTs interface possesses prominent characteristics and potential for directing the deep applications of 1D or 2D carbon materials in electronic science.

Excellent heat transfer enhancement of CNT-metal interface by loading carbyne and metal nanowire into CNT

Enhancing mechanism of CNT-CNT interface by metal nanoparticle and nanowire effect on the inside and outside of CNT

Experimental study on the thermal conductivity enhancement of water based nanofluids using different types of carbon nanotubes

Nano-engineering Thermal Transport Performance of Carbon Nanotube Networks with Polymer Intercalation: a Molecular Dynamics Study.

Modeling of carbon nanotube (CNT) interconnects

Modeling of Carbon Nanotube Interconnects and Comparative Analysis with Cu Interconnects

Experimental Investigation and Modelling on the Thermal Conductivity of CNTs Based Nanofluids

On Transport Properties of CNT Metal/semiconductor/metal Heterostructures Using First Principles Methods

Nanoengineering Heat Transfer Performance At Carbon Nanotube Interfaces

Modulating heat transport inside CNT assemblies: Multi-level optimization and structural synergy

The Interface Design of CNTs and Cu Matrix

Nanoscale Dispersion of Carbon Nanotubes in a Metal Matrix to Boost Thermal and Electrical Conductivity via Facile Ball Milling Techniques

Pool Boiling Heat Transfer During Quenching in Carbon Nanotube (Cnt)-Based Aqueous Nanofluids: Effects of Length and Diameter of the CNTs

Advances of CNT-based Systems in Thermal Management

Molecular Dynamics Simulations of Thermal Transport of Carbon Nanotube Interfaces

Interface Engineering for High-Performance Thermoelectric Carbon Nanotube Films

Metal-filled Carbon Nanotubes for Nanomechatronics

Elaborate manipulation on CNT intertube heat transport by using a polymer knob

Theoretical and experimental studies of nucleation and interface structure between carbon nanotubes and metals

Enhanced electrical conductivity and hardness of Copper/Carbon Nanotubes composite by tuning the interface structure

Meaningful improvements on structural-thermal-electronic properties of copper based on 3D nitrogen (N) doped-carbon nanotubes (CNTs) interface fabricated by nano-self-assembly-sintering-modification