Core-Shell Engineered Fillers Overcome the Electrical-Thermal Conductance Trade-Off

PeiChi Liao,Haichang Guo,Hongyu Niu,Ruijie Li,Ge Yin,Lei Kang,Liuchen Ren,Ruicong Lv,Huifeng Tian,Shizhuo Liu,Zhixin Yao,Zhenjiang Li,Yihan Wang,Lina Yang Zhang,U Sasaki,Wenxi Li,Yijie Luo,Junjie Guo,Zhi Xu,Lifen Wang,Ruqiang Zou,Shulin Bai,Lei Liu
DOI: https://doi.org/10.1021/acsnano.4c09346
IF: 17.1
2024-10-25
ACS Nano
Abstract:The rapid development of modern electronic devices increasingly requires thermal management materials with controllable electrical properties, ranging from conductive and dielectric to insulating, to meet the needs of diverse applications. However, highly thermally conductive materials usually have a high electrical conductivity. Intrinsically highly thermally conductive, but electrically insulating materials are still limited to a few kinds of materials. To overcome the electrical-thermal...
materials science, multidisciplinary,chemistry, physical,nanoscience & nanotechnology
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