P‐5.7: Examining Pressure‐sensitive Damping Silicone Adhesive with Excellent Cushioning Capabilities for AMOLED Display

Xuelin Fan,Yu Gu,Renjie Liu
DOI: https://doi.org/10.1002/sdtp.17235
2024-04-01
SID Symposium Digest of Technical Papers
Abstract:With the market for organic light‐emitting diodes expanding, the devices' cushioning capabilities and lightweight design are attracting more attention and causing issues. In this study, a unique type of pressure‐sensitive silicone adhesive is proposed. Meanwhile, a damping silicone pressure‐sensitive adhesive is added to the light‐emitting diode module, increasing its drop height from 40 to 55 mm and satisfying the controlled demand for the cushioning quality.
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