Negative constant voltage stress-induced threshold voltage instability in hydrogen-terminated diamond MOSFETs with low-temperature deposited Al 2 O 3

Zhihao Chen,Xinxin Yu,Jianjun Zhou,Shuman Mao,Yu Fu,Bo Yan,Ruimin Xu,Yuechan Kong,Tangsheng Chen,Yanrong Li,Yuehang Xu
DOI: https://doi.org/10.1063/5.0020136
IF: 4
2020-09-28
Applied Physics Letters
Abstract:Threshold voltage analysis can help reveal the reliability of semiconductor transistors and its underlying mechanism. Herein, negative constant voltage stress (NCVS)-induced threshold voltage instability is studied in hydrogen-terminated diamond metal-oxide-semiconductor field-effect transistors (HD MOSFETs) with an Al<sub>2</sub>O<sub>3</sub> dielectric layer deposited via atomic layer deposition at 90 °C. An unusual bidirectional shift in threshold voltage (<i>V<sub>th</sub></i>) can be observed with time. When a weak gate NCVS is applied, <i>V<sub>th</sub></i> gradually decreases during the first 500 s but increases in the next 500 s. A similar but opposite phenomenon is observed when the HD MOSFETs are in a recovery stage upon removing the NCVS, i.e., <i>V<sub>th</sub></i> increases in the first 500 s but decreases in the next 4500 s. A kinetic hydrogen motion model shows that this phenomenon can be attributed to the larger characteristic time constant of the unactuated oxygen-dangling bonds (UODBs) compared to that of the traps in the gate dielectric. Consequently, the trapping effect dominates and decreases <i>V<sub>th</sub></i> at the onset of NCVS. After 500 s, the UODB effects can be observed, increasing <i>V<sub>th</sub></i>. In the recovery stage, <i>V<sub>th</sub></i> is larger than the initial value. Further, modified hydrogen kinetic equations accounting for the dynamic effects of UODBs and traps are provided to quantitatively analyze the results.
physics, applied
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