Abstract:The inherent thermal transport properties of epoxy resin are vital factors to be studied in applications. In the present work, we constructed the amorphous crosslinking structure, the step crosslinking structure and the ordered crosslinking structure based on molecular dynamics theory, and used the reverse nonequilibrium molecular dynamics (RNEMD) method to calculate the thermal conductivity (TC) of different structures. Based on the numerical verification of the reliability of the method, the contribution of bonding to the TC was enhanced by increasing the molecular arrangement orderliness to reduce phonon scattering, taking the composition of the TC contribution as the guide. Meanwhile, the contribution of non-bonding interaction to the TC was enhanced by using compression process to achieve TC increase in the epoxy resin intrinsic structure, followed by exploring the effect of cross-linking degree on the TC of different structures. The results showed that the TC of amorphous epoxy resin decreased with the increase of crosslinking degree, and the relative high-frequency VDOS increased, but the influence of crosslinking degree on TC was minor in the range. For amorphous epoxy resin four-sided pressurization varied in the range of 0–7 Gpa, the non-bond energy percentage increased in the range of 0–60%, and the increase of non-bond energy made its contribution to TC increased significantly. The epoxy resin achieved 215% improvement in intrinsic TC by changing the molecular arrangement orderliness. The ordered structure TC varied from 0.3 to 3.5 W/(m⋅K) in the pressure variation range of 0–7 GPa. As the structure becomes more ordered, the TC increased significantly with the degree of cross-linking. The study provided the theoretical basis for the realization of resin preparation and resin thermal property evaluation with regulated intrinsic TC.

The effect of different active diluents on the properties of epoxy materials

Investigation of Electrical and Thermal Behavior of Modified Epoxy Structures for DC and High Frequency Applications

Effect of Active Diluents on Properties of Epoxy Compounds and Coatings Based on Them

Molecular Dynamics Simulations of Mechanical Properties of Epoxy-Amine: Cross-linker Type and Degree of Conversion Effects

Contributions of Side Groups to the Water Diffusion in Cured Epoxy Resins (2) Study on Physical Aging

Experimental and Finite Element Analysis of Epoxy-Based Composites for Packaging Materials to Reduce Electric Field and Power Loss under AC and DC Conditions

The Inlfuence of Reactive Diluent on Properties of Epoxy Resin Coatings

Effect of active diluent content on the technological properties of VARTM resin

EFFECT OF REACTIVE DILUENT CONTENT ON DAMPING PROPERTY OF EPOXY RESIN SYSTEM

Effects of Active Diluents on Solidifying Process of UV-curing Reaction for Polyurethane Acrylate

The effect of epoxy resin and curing agent groups on mechanical properties investigated by molecular dynamics

Effects of reactive diluent on processing, structure, and properties of epoxy foams and their sandwich composites

Comparative study of reactive diluents with different molecular structures on the curing properties of epoxy adhesives and the interface bonding properties with mortar

The effects of the contents of modified‐diatomite on the properties of modified‐diatomite/epoxy resin composites

The Effect of an Active Diluent on the Properties of Epoxy Resin and Unidirectional Carbon-Fiber-Reinforced Plastics

Study on the Influence of Cross-linked Network Modifiers on the Dielectric Properties of Epoxy Resin

Study on the Curing Reaction, Dielectric and Thermal Performances of Epoxy Impregnating Resin with Reactive Silicon Compounds As New Diluents

The Effect of Epoxide on Molecular Chain Relaxation on Bisphenol A Epoxy Resin after Curing

Thermal Conductivities and Mechanical Properties of Epoxy Resin as a Function of the Degree of Cross-linking

Improving inherent thermal conductivity of epoxy resins based on contribution components of thermal conductivity: A molecular dynamics study