Abstract:Effective thermal management is key to ensuring the reliable operation of high power electronic equipment. In this study, the strategy of phase transition and liquid cooling coupling applied to transient high power electronic equipment has been examined. In order to improve the performance of the phase changing material (PCM) in temperature control, the effects of the coupling structure have been addressed with a consideration of fin, copper foam (CF), graphite foam (GF), fin-copper foam (FCF) and fin-graphite foam (FGF) structures in heat dissipation. In this study, pure paraffin wax (PPW) was used as phase change material to prepare heat sinks based on the above five structures. The experimental study investigates the impact of different thermal conductivity strategies on temperature control characteristics, with a focus on cold capacity recovery and the combined phase change and liquid cooling, using pure paraffin wax module as a reference. The results have revealed that the fin-foam coupling structure delivers a better PCM performance than the single fin or foam structure. Operating at a heating power of 10 W, 15 W and 20 W, the temperature control time of the FGF structure was increased by 13.6 %∼14.6 % relative to the GF structure. At 15 °C with flow rates of 1 L/min, 1.5 L/min, 2 L/min liquid cooling conditions, the cooling capacity recovery time was reduced by 18.8 %, 17.2 %, 19.7 %, respectively. In the phase-change liquid-cooling coupling temperature control experiment, the final temperature increase in the FGF system was 11.7 °C -15.2 °C lower than that of the GF system under the same water temperature and volume flow for a 50 W heat source. The incorporation of fins also enhanced the thermal conductivity strengthening capability of the copper foam and reduced the cold recovery time. Based on the comprehensive evaluation, the FGF structure demonstrates superior temperature control performance and cold recovery characteristics of PCM, making it an optimal strengthening method. Following closely are the FCF, GF, Fin and CF structures. Compared to pure paraffin modules, these five modules exhibit varying degrees of improvement in temperature control and cold capacity recovery efficiency. This study provides guidance for optimizing heat sink design based on PCM in electronic applications.

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