Development of a reduced-order AROMM model for the nonlinear thermal simulation of electronic components

Fatme Mustapha,Frédéric Joly,Valentin Bissuel,Olivier Quéméner
DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2024.125909
IF: 5.2
2024-07-13
International Journal of Heat and Mass Transfer
Abstract:The thermal comportment of a microchip with four heat sources made in a highly nonlinear material is considered, for various boundary conditions and thermal loads. To save computation time, a Reduced Order Model (ROM) is proposed to replace the original and high-order model. Among the different reduction methods, a modal method is chosen. The non-linearity is taken into account via a simplified quadratic law. This leads to a simple formulation and a prompt numerical implementation. The ROM is highly reliable whatever the environment conditions and the activated source, while the computation time is reduced by a factor 300.
engineering, mechanical,mechanics,thermodynamics
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