Abstract:The dry release transfer of two-dimensional (2D) materials such as graphene, h-BN, and TMDs is a versatile method for fabricating high-quality van der Waals heterostructures. Up until now, polydimethylpolysiloxane (PDMS) sheets have been widely used for the dry release transfer of TMD materials. However, this method has been known to have limitations that make it difficult to transfer few-layer-thick graphene and h-BN because of the difficulty to fabricate these materials on PDMS. As an alternative method, we demonstrate the dry release transfer of single- and bi-layer graphene and few-layer h-BN in this study by utilizing poly(propylene) carbonate (PPC) films. Because of the strong adhesion between PPC and 2D materials around room temperature, we demonstrate that single- to few-layer graphene, as well as few-layer h-BN, can be fabricated on a spin-coated PPC film/290-nm-thick SiO2/Si substrate via the mechanical exfoliation method. In addition, we show that these few-layer crystals are clearly distinguishable using an optical microscope with the help of optical interference. Because of the thermoplastic properties of PPC film, the adhesion force between the 2D materials and PPC significantly decreases at about 70 {\deg}C. Therefore, we demonstrate that single- to few-layer graphene, as well as few-layer h-BN flakes, on PPC can be easily dry-transferred onto another h-BN substrate. This method enables a multilayer van der Waals heterostructure to be constructed with a minimum amount of polymer contamination. We demonstrate the fabrication of encapsulated h-BN/graphene/h-BN devices and graphene/few-layer h-BN/graphene vertical-tunnel-junction devices using this method. Since devices fabricated by this method do not require an edge-contact scheme, our finding provide a simples method for constructing high-quality graphene and h-BN-based van der Waals heterostructures.

Dry Transfer of van der Waals Junctions of Two-Dimensional Materials onto Patterned Substrates Using Plasticized Poly(vinyl chloride)/Kamaboko-Shaped Polydimethylsiloxane

High-Fidelity Transfer of Chemical Vapor Deposition Grown 2D Transition Metal Dichalcogenides Via Substrate Decoupling and Polymer/Small Molecule Composite.

Pattern Transfer for Van Der Waals Integration

Deterministic transfer of two-dimensional materials by all-dry viscoelastic stamping

Recent Progress on Transfer Techniques of Two-Dimensional Atomically Thin Semiconductor

Pinpoint pick-up and bubble-free assembly of 2D materials using PDMS/PMMA polymers with lens shapes

A tale of two transfers: characterizing polydimethylsiloxane viscoelastic stamping and heated poly bis-A carbonate transfer of hexagonal boron nitride

Strategy for transferring van der Waals materials and heterostructures

Dry release transfer of graphene and few-layer h-BN by utilizing thermoplasticity of polypropylene carbonate for fabricating edge-contact-free van der Waals heterostructures

Dry Transfer Based on PMMA and Thermal Release Tape for Heterogeneous Integration of 2D-TMDC Layers

Etchant-free transfer of 2D nanostructures

Universal Transfer and Stacking of Chemical Vapor Deposition Grown Two-Dimensional Atomic Layers with Water-Soluble Polymer Mediator

Fast Digital Patterning of Surface Topography Toward Three-Dimensional Shape-Changing Structures

Minimizing Residues and Strain in 2D Materials Transferred from PDMS

Versatile polymer method to dry-flip two-dimensional moiré hetero structures for nanoscale surface characterization

Facile fabrication of 2D material multilayers and vdW heterostructures with multimodal microscopy and AFM characterization

A volatile polymer stamp for large-scale, etching-free, and ultraclean transfer and assembly of two-dimensional materials and its heterostructures

Strain in 2D TMDCs induced by metal-assisted exfoliation from the polyvinilalcohol-covered substrate

Translating 2D Director Profile to 3D Topography in a Liquid Crystal Polymer

High-Fidelity Transfer of 2D Semiconductors and Electrodes for Van Der Waals Devices

Self‐Organization via Dewetting in Polymeric Assemblies