Dry release transfer of graphene and few-layer h-BN by utilizing thermoplasticity of polypropylene carbonate for fabricating edge-contact-free van der Waals heterostructures

Kei Kinoshita,Rai Moriya,Momoko Onodera,Yusai Wakafuji,Satoru Masubuchi,Kenji Watanabe,Takashi Taniguchi,Tomoki Machida
DOI: https://doi.org/10.48550/arXiv.1904.12170
2019-04-27
Applied Physics
Abstract:The dry release transfer of two-dimensional (2D) materials such as graphene, h-BN, and TMDs is a versatile method for fabricating high-quality van der Waals heterostructures. Up until now, polydimethylpolysiloxane (PDMS) sheets have been widely used for the dry release transfer of TMD materials. However, this method has been known to have limitations that make it difficult to transfer few-layer-thick graphene and h-BN because of the difficulty to fabricate these materials on PDMS. As an alternative method, we demonstrate the dry release transfer of single- and bi-layer graphene and few-layer h-BN in this study by utilizing poly(propylene) carbonate (PPC) films. Because of the strong adhesion between PPC and 2D materials around room temperature, we demonstrate that single- to few-layer graphene, as well as few-layer h-BN, can be fabricated on a spin-coated PPC film/290-nm-thick SiO2/Si substrate via the mechanical exfoliation method. In addition, we show that these few-layer crystals are clearly distinguishable using an optical microscope with the help of optical interference. Because of the thermoplastic properties of PPC film, the adhesion force between the 2D materials and PPC significantly decreases at about 70 {\deg}C. Therefore, we demonstrate that single- to few-layer graphene, as well as few-layer h-BN flakes, on PPC can be easily dry-transferred onto another h-BN substrate. This method enables a multilayer van der Waals heterostructure to be constructed with a minimum amount of polymer contamination. We demonstrate the fabrication of encapsulated h-BN/graphene/h-BN devices and graphene/few-layer h-BN/graphene vertical-tunnel-junction devices using this method. Since devices fabricated by this method do not require an edge-contact scheme, our finding provide a simples method for constructing high-quality graphene and h-BN-based van der Waals heterostructures.
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