Abstract:We have modified the metal-assisted transfer technique to obtain large-area few-layer flakes from transition metal dichalcogenides bulk crystals by introducing an initial stage - exfoliation of the bulk crystal onto an intermediate substrate, specifically a silicon wafer coated with polyvinyl alcohol. Following this, we thermally evaporate silver onto the sample and transfer the top layers of the crystal along with the silver layer to the target substrate. This technique allows the production of visually non-corrugated single- and few-layer flakes with high yield. A direct comparison of the micro-Raman and micro-photoluminescence spectra of flakes exfoliated using our method with the spectra of those exfoliated from scotch tape reveals differences in their properties. We identify signatures of deformations in the flakes exfoliated from the intermediate substrate, indicating the presence of static friction between the substrate and the flake. Our findings thus suggest a novel method to induce intrinsic deformation in 2D materials.

What problem does this paper attempt to address?

This paper aims to solve the defect problems, such as cracks, wrinkles and ripples, etc., generated during the mechanical exfoliation process of transition metal dichalcogenides (TMDCs). These problems usually occur in large - area single - layer or multi - layer TMDC materials prepared by metal - assisted exfoliation techniques, limiting the application of these materials in micro - and nano - electronics. To overcome these problems, the authors proposed an improved metal - assisted transfer technique. That is, first, the bulk crystal is mechanically exfoliated onto an intermediate substrate coated with polyvinyl alcohol (PVA), then a silver layer is deposited by thermal evaporation, and finally the top - layer TMDC material is transferred onto the target substrate. This method can obtain visually ripple - free single - layer or multi - layer TMDC materials with a relatively high yield. In addition, the authors also found that the materials exfoliated by this method still have strain after being transferred to the target substrate, which may be due to the static friction between the material and the substrate. This finding provides a new method for regulating the properties of TMDC materials. Specifically, the paper achieved the above goals through the following steps: 1. **Initial Exfoliation**: The bulk TMDC crystal is mechanically exfoliated onto a silicon wafer coated with PVA to form a large - area multi - layer TMDC flake. 2. **Metal Deposition**: A layer of silver (50 nm) and aluminum (200 nm) is deposited on these multi - layer flakes by electron - beam evaporation to increase the rigidity of the film. 3. **Transfer Process**: Using photoresist as a buffer layer, the metal layer and TMDC flake are exfoliated from the intermediate substrate and transferred to the target substrate. 4. **Cleaning Treatment**: The photoresist is cured by heating, the Scotch tape is removed, the photoresist is removed with acetone, and the organic residues are removed by oxygen plasma treatment. Finally, the metal layer is removed by wet etching to obtain clean TMDC single - layer or multi - layer materials. Through the characterization of micro - Raman spectroscopy and micro - photoluminescence spectroscopy, the authors found that the TMDC materials prepared by this method still have strain after being transferred to the target substrate, indicating that there is significant static friction between the material and the substrate. This finding not only provides a new perspective for understanding the physical properties of TMDC materials, but also provides a new way to regulate the performance of these materials.

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