Slow crack growth : models and experiments

Stéphane Santucci,Loic Vanel,Sergio Ciliberto

DOI: https://doi.org/10.1140/epjst/e2007-00192-9

2007-03-28

Abstract:The properties of slow crack growth in brittle materials are analyzed both theoretically and experimentally. We propose a model based on a thermally activated rupture process. Considering a 2D spring network submitted to an external load and to thermal noise, we show that a preexisting crack in the network may slowly grow because of stress fluctuations. An analytical solution is found for the evolution of the crack length as a function of time, the time to rupture and the statistics of the crack jumps. These theoretical predictions are verified by studying experimentally the subcritical growth of a single crack in thin sheets of paper. A good agreement between the theoretical predictions and the experimental results is found. In particular, our model suggests that the statistical stress fluctuations trigger rupture events at a nanometric scale corresponding to the diameter of cellulose microfibrils.

Materials Science

What problem does this paper attempt to address?

### Problems the paper attempts to solve

This paper aims to study the slow crack growth of brittle materials under a constant load below the critical fracture threshold (creep test). Specifically, the author attempts to understand the following issues through theoretical modeling and experimental verification:

1. **Mechanism of slow crack growth**: The author proposes a model based on the thermally activated fracture process to explain how cracks grow slowly due to stress fluctuations.

2. **Evolution of crack length over time**: The author derives an analytical solution for the evolution of crack length over time and predicts the dynamic behavior of crack growth.

3. **Statistical properties of crack jumps**: The author analyzes the statistical properties of crack jump events to verify the accuracy of the theoretical model.

4. **Experimental verification**: The author experimentally studies the sub - critical growth of a single crack in a thin paper sheet and verifies the consistency between theoretical predictions and experimental results.

### Key point summary

- **Model assumption**: Crack growth is caused by local damage accumulation triggered by stress fluctuations due to thermal noise.
- **Theoretical derivation**: By introducing the Griffith energy barrier and Arrhenius' law, the author derives the equation for the evolution of crack length over time.
- **Experimental design**: Use a thin paper sheet as the experimental material, apply a constant load, and observe the slow growth process of cracks.
- **Result verification**: The experimental results are in good agreement with the theoretical predictions, especially in terms of the statistical properties of crack jumps.

### Formula presentation

1. **Griffith energy barrier**:
\[
E_G(L)=-\frac{\pi L^2\sigma^2}{4Y}+2\gamma L + E_0
\]
where \(Y\) is Young's modulus, \(\gamma\) is surface energy, and \(E_0\) is the elastic energy without cracks.

2. **Arrhenius' lifetime formula**:
\[
\tau\sim\exp\left(\frac{\Delta U}{k_BT}\right)
\]
where \(k_B\) is the Boltzmann constant, \(T\) is the temperature, and \(\Delta U\) is the energy barrier.

3. **Crack velocity formula**:
\[
v = \frac{dL}{dt}\simeq\frac{\lambda}{\tau_e}\sqrt{\frac{Y\lambda k_BT}{2\pi V}}\frac{1}{K_c - K}\exp\left[-\frac{(K_c - K)^2V}{2Y\lambda k_BT}\right]
\]

4. **Characteristic growth length \(\zeta\)**:
\[
\zeta=\frac{2Y\lambda k_BT L_i}{V K_i(K_c - K_i)}
\]

Through these formulas, the author successfully describes the slow growth process of cracks under thermal activation and verifies the validity of the model through experiments.