Abstract:A facile and green ball milling shear method is utilized for generating MXene@BN. The multi‐functional fillers (MXene@BN) are constructed and incorporated into polydimethylsiloxane (PDMS) to prepare a multifunctional‐composites (PDMS/MXene@BN) for achieving improved electromagnetic interference (EMI) shielding performance and enhanced thermal conductivity as well as flame retardancy simultaneously. This work provides a biomimetic method for manufacturing high‐performance composite materials with excellent flame retardancy and thermal conductivity as well as EMI shielding and has great prospects for applications in electronic devices. Composite polymer materials featured superior thermal conductivity, flame retardancy, and electromagnetic shielding performance are increasingly in demand due to the rapid development of highly miniaturized, portable, and flexible electronic devices. Herein, a facile and green ball milling shear method is utilized for generating MXene@Boron nitride (MXene@BN). The multi‐functional fillers (MXene@BN) are constructed and incorporated into polydimethylsiloxane (PDMS) to prepare a multifunctional composite (PDMS/MXene@BN) for achieving improved electromagnetic interference (EMI) shielding performance and thermal conductivity as well as flame retardancy simultaneously. When the PDMS/MXene@BN composite has a MXene@BN loading of 2.4 wt.%, it exhibits a high thermal conductivity of 0.59 W m−1K−1, which is 210% higher than that of the pure PDMS matrix. This is attributed to its unique chestnut‐like double‐layer structure. With a smoke production rate (SPR) of 0.04 m2 s−1 and total smoke production (TSP) of 3.51 m2, PDMS/MXene@BN 2.4 composite exhibits superb smoke suppression properties. These SPR and TSP values are 63.20% and 63.50% lower than the corresponding values of pure PDMS. Moreover, the EMI SE of the PDMS/MXene@BN 2.4 can reach 26.3 dB at 8.5 GHz. The work reported herein provides valuable insight into developing composites with multiple functions, which show strong potential for application in advanced packaging materials.

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