Design of ultra-microporous COF for effectively enhancing the dielectric and fire resistance of bismaleimide based electronic packaging material

Yifan Zhou,Wei Liu,Wenbin Ye,Shengzhe Li,Fukai Chu,Weizhao Hu,Lei Song,Yuan Hu
DOI: https://doi.org/10.1016/j.cej.2023.148409
IF: 15.1
2024-01-05
Chemical Engineering Journal
Abstract:Most common flame retardants have high polarizability, so introducing flame retardants with simple structures to simultaneously improve the flame retardancy and dielectric properties of bismaleimide resin is a technical challenge. This work utilized the unique microporous structure of covalent organic framework (COF) as a low dielectric factor combined with molecular design to synthesize phosphonitrile based COF-N with a pore size of approximately 1.8 nm. The dielectric constant (D k ) of BMI composite containing 1 wt% COF-N (BMI/COF-N 1.0) is as low as 2.76, far exceeding the requirement of less than 3. Moreover, BMI/COF-N 1.0 achieved UL94 at V0 rating, with a 37.9 % reduction in total heat release (THR) and a 55.6 % reduction in total smoke production (TSP), demonstrating excellent fire safety. In addition, the glass transition temperature ( Tg ) exceeds 290 °C, which is greater than the heat resistance required for lead-free reflow soldering at 260 °C. Therefore, a simple method is provided to prepare high-performance BMI based electronic packaging substrates.
engineering, chemical, environmental
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