Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures

Ziyang Wang,Fangyuan Sun,Zihan Liu,Libing Zheng,Dazheng Wang,Yanhui Feng
DOI: https://doi.org/10.1021/acsami.2c21514
IF: 9.5
2023-03-17
ACS Applied Materials & Interfaces
Abstract:Interfacial structure optimization is important to enhance the thermal boundary conductance (TBC) as well as the overall performance of thermal conductive composites. In this work, the effect of interfacial roughness on the TBC between copper and diamond is investigated with molecular dynamics (MD) simulations and time-domain thermoreflectance (TDTR) experiments. It is found from MD simulations that the thermal transport efficiency across a rough interface is higher, and the TBC can be improved...
materials science, multidisciplinary,nanoscience & nanotechnology
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