High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability (Adv. Mater. Interfaces 6/2024)

Seong‐Bae Min,Yongsu Jo,Seoung Young Ryu,Joohyung Lee,Cheol‐Woo Ahn,Chae Bin Kim
DOI: https://doi.org/10.1002/admi.202470019
IF: 5.4
2024-02-24
Advanced Materials Interfaces
Abstract:Thermal Paste Alumina‐stabilized emulsions composed of immiscible silicone oil and glycerol are prepared as thermal pastes. In article 2300860, Joohyung Lee, Cheol‐Woo Ahn, Chae Bin Kim and co‐workers show that due to the self‐assembled alumina at the liquid–liquid interface, the paste exhibits improved thermal conductivity and stability, allowing syringe extrusion, 3D printing, reprocessing/molding, and eco‐friendly recycling.
materials science, multidisciplinary,chemistry
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