Low lattice thermal conductivity and enhanced thermoelectric performance of SnTe via chemical electroless plating of Ag

Bang-Zhou Tian,Xu-Ping Jiang,Jie Chen,Han Gao,Ze-Gao Wang,Jun Tang,Da-Li Zhou,Lei Yang,Zhi-Gang Chen
DOI: https://doi.org/10.1007/s12598-021-01805-1
IF: 6.318
2021-08-16
Rare Metals
Abstract:Interface engineering has been regarded as an effective strategy to manipulate the thermoelectric performance of materials. Here, we use a facile chemical electroless plating and a spark plasma sintering process to fabricate Ag-plated SnTe bulk. After sintering, a small amount of plated Ag can be doped into SnTe to suppress the Sn vacancies and the others form Ag precipitates with a size distribution from nanoscale to microscale, which introduces Ag/SnTe interfaces to enhance the Seebeck coefficient via energy filtering effect. Simultaneously, these structures result in strong scattering to reach a low lattice thermal conductivity of ~ 0.62 W·m–1·K–1. Consequently, a maximum figure of merit (zT) of ~ 0.67 at 823 K is achieved in 2 wt% Ag-plated SnTe, which is ~ 60% higher than that of pristine SnTe. Moreover, the microhardness indentation test results show that the mean microhardness of 2 wt% Ag-plated SnTe is HV 64.26, which is much higher than that of pristine SnTe, indicating that Ag electroless plating can improve the mechanical properties of SnTe. This work has provided a facile and eco-friendly method to realize the interface engineering for manipulating the thermoelectric and mechanical properties of SnTe.Graphical abstract
materials science, multidisciplinary,metallurgy & metallurgical engineering
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