Fabrication and Characterization of Al2O3-Siloxane Composite Thermal Pads for Thermal Interface Materials

Seul-Ki Kim,Yeong-Jin Koo,Hyun Sik Kim,Jong-Keun Lee,Kyounghoon Jeong,Younki Lee,Eun Young Jung
DOI: https://doi.org/10.3390/ma17040914
IF: 3.4
2024-02-17
Materials
Abstract:In this study, Al2O3–siloxane composite thermal pads were fabricated using a tape–casting technique, and the thermal conductivity effect of the Al2O3 nanoparticle powder synthesized using a flame fusion process on siloxane composite thermal pads was investigated. Furthermore, various case studies were implemented, wherein the synthesized Al2O3 nanoparticle powder was subjected to different surface treatments, including dehydration, decarbonization, and silylation, to obtain Al2O3–siloxane composite thermal pads with high thermal conductivity. The experimental results confirmed that the thermal conductivity of the Al2O3–siloxane composite pads improved when fabricated using surface–treated Al2O3 nanoparticle powder synthesized with an optimally spheroidized crystal structure compared to that produced using non–treated Al2O3 nanoparticle powder. Therefore, this study provides guidelines for fabricating Al2O3–siloxane composite thermal pads with high thermal conductivity in the field of thermal interface materials.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
What problem does this paper attempt to address?
### Problems the Paper Aims to Solve The paper aims to address the issue of increased heat generation in electronic devices during the process of miniaturization and integration. Specifically, the research objective is to improve the performance of alumina (Al₂O₃) nanoparticle powder through surface treatment techniques (including dehydration, decarbonization, and silanization) to enhance its compatibility with silicone composites, ultimately preparing alumina-silicone composite thermal pads with high thermal conductivity. ### Research Background With the development of microelectronic technology, the integration and miniaturization of electronic components have continuously increased, leading to more heat generation during operation. To ensure good thermal conductivity, researchers have developed various thermal interface materials (Thermal Conductive Materials, TCMs). Among them, thermally conductive adhesives (such as epoxy resin) are widely used due to their ease of processing and low cost. However, the thermal conductivity of epoxy resin itself is relatively low, requiring the addition of ceramic, carbon, or metal particles to improve thermal conductivity. Adding metal particles can compromise the electrical insulation and dielectric properties of the composite material; while carbon materials have high thermal conductivity and lightweight characteristics, they are costly and have poor electrical insulation properties. In contrast, ceramic particles have excellent thermal conductivity and mechanical properties, making them a subject of extensive research. ### Research Methods The paper details the following experimental steps: 1. **Preparation of Alumina Nanoparticle Powder**: Spherical Al₂O₃ nanoparticle powder is synthesized using the flame fusion method. 2. **Surface Treatment**: The synthesized Al₂O₃ nanoparticle powder undergoes dehydration, decarbonization, and silanization treatments to remove surface impurities and improve compatibility with silicone. 3. **Preparation of Composite Thermal Pads**: Using Al₂O₃ nanoparticle powder with different surface treatments, Al₂O₃-silicone composite thermal pads are prepared through tape casting technology. 4. **Characterization and Analysis**: The composite thermal pads are characterized using various techniques such as X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM), Fourier-transform infrared spectroscopy (FT-IR), inductively coupled plasma optical emission spectrometry (ICP-OES), and nuclear magnetic resonance (NMR). ### Main Conclusions The research results indicate that the optimized surface-treated Al₂O₃ nanoparticle powder can significantly enhance the thermal conductivity of Al₂O₃-silicone composite thermal pads, providing important guidance for the field of thermal interface materials.