Abstract:Planar magnetic components are compact and less susceptible to skin effect due to their thin copper layers. However, the increase in parasitic capacitance has been a challenge in high-frequency operation of planar transformers (PTs). Parasitic capacitances resonate with inductance and may damage switch devices. Thicker printed circuit board (PCB) and reconfigured windings are suggested in this paper to mitigate the parasitic capacitances. A detailed analysis of the parasitic capacitances is performed with a prototype PT. The resonant frequency increased from 1.27 to 1.63 MHz with a 0.4 mm thicker PCB. The reconfigured PT was 1.38 MHz, 0.3 MHz higher than the original PT.

What problem does this paper attempt to address?

The paper primarily focuses on the issues encountered by planar transformers (PTs) during high-frequency operation, particularly the challenges posed by parasitic capacitance. Planar transformers are favored in high-density converter designs due to their compact design and reduced skin effect. However, at high frequencies, the parasitic capacitance between the copper layers within the planar transformer can resonate with the transformer's inductance, potentially leading to damage to switching devices or causing electromagnetic interference (EMI) issues. To address this challenge, the paper proposes two methods to reduce the impact of parasitic capacitance: 1. **Increasing the thickness of the printed circuit board (PCB)**: By increasing the thickness of the dielectric layer, the distance between adjacent copper layers is increased, thereby reducing the parallel plate capacitance value and consequently raising the resonance frequency. 2. **Reconfiguring the winding structure**: By minimizing the overlap area between copper traces, the parasitic capacitance can be reduced. Although this may require an increase in the number of layers, a higher resonance frequency can be achieved by altering the winding layout. The paper provides a detailed analysis of these methods and validates their effectiveness through theoretical calculations, simulations, and prototype testing. The results show that the method of increasing PCB thickness can raise the resonance frequency from 1.27 MHz to 1.63 MHz, while reconfiguring the winding structure can increase the resonance frequency by 0.3 MHz compared to the original design. These improvements help ensure that the performance of the converter does not degrade during high-frequency operation.

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