Development and characterization of polymeric thermal interface material using aluminized glass fiber, bamboo fiber, and sugarcane bagasse carbon quantum dots

S. Ramu,N. Senthilkumar,B. Deepanraj
DOI: https://doi.org/10.1007/s13399-024-05595-1
IF: 4.05
2024-04-10
Biomass Conversion and Biorefinery
Abstract:This study is dedicated to the development and characterizes a polymeric thermal interface material (TIM) that incorporates aluminized glass fiber, bamboo fibers, and carbon quantum dots (CQDs) derived from sugarcane bagasse. Surface treatment was carried out on fibers and filler particles to ensure proper adhesion with the matrix. The fabrication methodology employed compression molding with constituent materials and the polymer matrix. The test specimens undergo a characterization process in accordance with ASTM standards. Notably, among the fabricated composite designations, ABC3 (polyester resin with 30 vol.% of aluminized glass/bamboo fibers and 2 vol.% of carbon quantum dots) gives improved mechanical properties. This includes a tensile strength of 129 MPa, flexural strength of 182 MPa, interlaminar shear strength of 22.5 MPa, impact energy of 4.3 J, and a hardness of 78 shore-D. In the fatigue test, the composite ABC3 exhibited higher fatigue counts of 37,276; 35,010; and 28,109 for 25%, 50%, and 75% of the ultimate tensile strength (UTS). Regarding thermal conductivity, the composite ABC3 produced an impressive thermal conductivity of 0.386 W/mK. This high thermal conductivity is attributed to the synergistic contribution of aluminized glass fibers and bamboo fibers in the presence of carbon quantum dots particles. In dielectric properties, ABC3 also surpasses other composite designations, exhibiting a dielectric constant of 4.52 and a dielectric loss of 0.57. These high thermal conductivity and marginal electrical conductivity make these composites a promising candidate for advanced applications in electrical appliance casing materials, printed circuit boards, and computer motherboards where the generated heat has to be released for better functionality.
energy & fuels,engineering, chemical
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