Abstract:Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to ‘rubber-band’ levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

Venation‐Mimicking, Ultra‐Stretchable, Room Temperature‐Attachable Metal Tapes for Integrated Electronic Skins

Venation-Mimicking, Ultrastretchable, Room-Temperature-Attachable Metal Tapes for Integrated Electronic Skins

Switching ultra-stretchability and sensitivity in metal films for electronic skins: a pufferfish-inspired, interlayer regulation strategy

High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

Highly Stable and Stretchable Conductive Films through Thermal‐Radiation‐Assisted Metal Encapsulation

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Highly stable and strain-insensitive metal film conductors via manipulating strain distribution

Liquid–metal Microgrid Stretchable Electronics Based on Bionic Leaf Veins with Ultra-Stretchability and High Conductivity

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Highly stretchable van der Waals thin films for adaptable and breathable electronic membranes

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

Three-Dimensional Coprinting Of Liquid Metals For Directly Fabricating Stretchable Electronics

Permeable superelastic liquid-metal fibre mat enables biocompatible and monolithic stretchable electronics

Stiffness and Interface Engineered Soft Electronics with Large-Scale Robust Deformability

Soft elastomeric composite materials with skin-inspired mechanical properties for stretchable electronic circuits.

Intrinsically Stretchable Electronics with High Performance and Large Integration Scale

Intrinsically stretchable electronics with ultrahigh deformability to monitor dynamically moving organs

Electronic Skin from High-Throughput Fabrication of Intrinsically Stretchable Lead Zirconate Titanate Elastomer

Mechanically Flexible Conductors for Stretchable and Wearable E-Skin and E-Textile Devices

Semi-liquid metal-based highly permeable and adhesive electronic skin inspired by spider web

A Highly Conductive and Stretchable Wearable Liquid Metal Electronic Skin for Long-Term Conformable Health Monitoring