Abstract:Abstract Surface-mount device light emitting diode (SMD-LED) is characterized by small size, wide viewing angle and light weight. It becomes the main package type of LED gradually. The traditional visual inspection is likely to cause misrecognition due to personal subjectivity and different defect recognition standards. Therefore, this study develops an automatic SMD-LED defect detection system, which is characterized by non-contact inspection, defect recognition standardization and upgrading product quality. It detects the common and important defects in LED package components, including missing component, no chip, wire shift and foreign material. In this study the gray scale characteristic of histogram is used as the rapid sieving analysis indicator of missing component defect, and then the component and solder joint are positioned by using fast normalized cross-correlation, and the maximum correlation coefficient value is used as judgment indicator of no chip defect. In order to overcome the difficult identification as the weld line is subject to light rays, the improved Michelson-like contrast (MLC) enhancement is proposed, and the segmentation threshold is selected by entropy information to segment the weld line successfully. Furthermore, in order to overcome the effect of the tolerance of component size and internal electrode and unfixed weld line position resulted from lead frame process on foreign material detection result, the multiscale adaptive Fourier analysis (MAFA) is proposed in the concept of texture anomaly detection for foreign material defect detection. The result proves that the proposed method can segment the defect effectively and correctly compared with the phase-only transform (PHOT) and multiscale phase-only transform (MPHOT), and it can be used in other fields of texture anomaly detection. The overall recognition rate of this system is 98.25%, contributing to the large market demand and high component quality of LED industry.

A CISG Method for Internal Defect Detection of Solar Cells in Different Production Processes

Automatic Defect Inspection for Monocrystalline Solar Cell Interior by Electroluminescence Image Self-Comparison Method

Multivariate image analysis in gaussian multi-scale space for defect detection

Automated visual inspection of solar cell images using adapted morphological and edge detection algorithms

Saliency-Based Defect Detection in Industrial Images by Using Phase Spectrum

Efficient Cell Segmentation from Electroluminescent Images of Single-Crystalline Silicon Photovoltaic Modules and Cell-Based Defect Identification Using Deep Learning with Pseudo-Colorization

Defect Detection with Generative Adversarial Networks for Electroluminescence Images of Solar Cells

Defect detection system for silicon solar panels under all-day irradiation

Solar Cell Surface Defect Inspection Based on Multispectral Convolutional Neural Network

Surface defect detection of solar cells based on Fourier single-pixel imaging for removal of substrates interference

Defect Detection in C-Si Photovoltaic Modules Via Transient Thermography and Deconvolution Optimization

Solar Cells Surface Defects Detection Based on Deep Learning

Defect Analysis of Solution-Based Process CIGS Thin-Film Solar Cells Using Technology Computer-Aided Design

Research of Solar Cell Surface Defect Detection System Based on Machine Vision

A Deep Two-Stage Scheme for Polycrystalline Micro-Crack Detection

Automatic Classification of Defective Photovoltaic Module Cells in Electroluminescence Images

A Condition Change Detection Method for Solar Conversion Efficiency in Solar Cell Manufacturing Processes

Polycrystalline Silicon Wafer Surface Color Defect Inspection Based on Machine Vision

Photoluminescence Imaging for the In-Line Quality Control of Thin-Film Solar Cells

Automated optical inspection system for surface mount device light emitting diodes

Inspection of circuit defect on LCD panel based on image contour analysis