Abstract:The alicyclic polyimide completely degrades during the electric breakdown process under a high electric field, a large number of gaseous products and resulting in a low residual carbon rate, thus achieving self‐healing capability for multiple electrical breakdowns, making it a potential dielectric material for new‐generation high‐temperature film capacitors. Polymer dielectrics with combined thermal stability and self‐healing properties are specifically desired for high‐temperature film capacitors. The high thermal stability of conventional polymers benefits from the abundance of aromatic rings in the molecule backbone, but the high carbon content sacrifices their self‐healing properties. Here, analicyclic polyimide with a high glass transition temperature (256 °C) and wide energy bandgap (4.58 eV) is designed, which exhibits electric conductivity more than an order of magnitude lower than that of classical polyimide at high electric fields and high temperatures. As a result, alicyclic polyimide achieves a discharged energy density of 4.54 J cm−3 and a charge‐discharge efficiency of above 90% at 200 °C, which is superior to existing dielectric polymers and composites. The alicyclic polyimide benefits from a low pyrolytic residual carbon rate, retaining 93% of the dielectric breakdown strength after four electrical breakdown cycles. Distinguishing from the current condensed‐phase self‐healing concept, for the first time, exploring the self‐healing capability of high‐temperature polyimide dielectric is presented based on dual self‐healing mechanisms of gas‐phase and condensed‐phase. The high energy density at high temperatures and the superior self‐healing capability of alicyclic polyimide further indicate the promise of polyimide dielectric film capacitors for extreme conditions.

High strength, stable and self-healing copolyimide for defects induced by mechanical and electrical damages

Dual regulation of flexible chain segments and dynamic covalent bonds for a self-healable copolyimide

Construction and self‐healing properties of thermoplastic polyimide based on dynamic covalent bonding

Recyclability and Self‐healing of Dynamic Cross‐linked Polyimide with Mechanical/Electrical Damage

Dynamic Sustainable Polyimide Film Combining Hardness with Softness via a “Mimosa‐Like” Bionic Strategy

Polyimide Films Impregnated with Epoxy Resin Demonstrating Superior Self-Healing Properties for Thermally Stable Energy Storage Capacitors

Solvent Resistant Self-Crosslinked Poly(ether Imide)

Preparing efficient self-healing polyimide coating for enhancing stability of electromagnetic interference shielding film

Self-healing hyperbranched poly(aroyltriazole)s

Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

Dynamic Covalent Adaptable Polyimide Hybrid Dielectric Films with Superior Recyclability

Alicyclic Polyimide With Multiple Breakdown Self‐Healing Based on Gas‐Condensation Phase Validation for High Temperature Capacitive Energy Storage

Ultrahigh tough, self-healing copolymer elastomer crosslinked by reversible imine system

Sustainable poly(imide‐imide) vitrimer based on multiple dynamic covalent bonds

Novel Polyetherimide Dielectrics: Molecular Design, Energy Storage Property, and Self-Healing Performance.

High-Performance Copolyimide Fibers Containing Quinazolinone Moiety: Preparation, Structure and Properties

Robust Poly(urethane-amide) Protective Film with Fast Self-Healing at Room Temperature

A molecular dynamics simulation on tunable and self-healing epoxy-polyimine network based on imine bond exchange reactions

Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure

Polyurethane combining preeminent toughness, puncture-resistance, and self-healing capabilities by multiple repair options based on dual dynamic covalent bonds

Polyether–maleimide‐based Crosslinked Self‐healing Polyurethane with Diels–Alder Bonds