Abstract:The ever-increasing demand for higher I/O counts on chip requires the finer pitches to improve the performance, cost effectiveness and higher yield. The conventional under bump metallization (UBM) technology may not guarantee the required performance due to higher current density and diffusivity nowadays. In order to overcome these challenges, a UBM with higher strength and resistance to diffusion, better thermal and microstructural properties are required. Recently, nano reinforced Ni-P alloy has been identified as potential approach. Especially, the addition of Carbon nanotube (CNT) was expected to provide strengthening to the resulting UBM layers. CNTs have exceptional and attractive thermal, electrical, and mechanical properties, and are believed to be ideal material for fabricating composites. However, due to the large surface volume ratio, CNTs have strong tendency to agglomerate, which results in clusters. CNT clusters may lead to void formation and further cracking. Therefore, it is of great importance to figure out methods to disperse and incorporate CNTs into Ni-P UBM. In order to disperse carbon nano-tubes in electroless Ni-P coatings, two approaches were employed. Chemical modification, which includes acid oxidation treatment and surfactant treatment were conducted to disperse CNT clusters. Meanwhile, magnetic stirring and ultrasonic agitation were also employed to prepare the CNT/Ni-P composite coatings with CNTs homogeneously embedded. SEM and TEM were used to observe the dispersion after adopting the aforementioned treatment as well as the surface morphology of the deposited layers. It was verified that the dispersion can be significantly improved after proper treatment process, and surface of the CNT/Ni-P was quite smooth; CNTs were equably dispersed throughout the matrix. In addition, the interfacial bonding between CNTs and Ni-P coatings was good and firm. In these cases, an understanding of the effects of the acid oxidation, surfactant dispersant- magnetic stirring and ultrasonic agitation on CNT dispersion in both solution and deposited layer were ascertained.

Performance of Carbon Nanotube on Nickel-Plated Copper Substrate Using Electrophoretic Deposition Process for Electronic Cooling Application: Response Surface Method Optimization

Fabrication of Three-dimensional Thermally Conductive Carbon Fibers/Carbon Nanotubes Network Reinforce Epoxy Composites

Effective method to disperse and incorporate Carbon nanotubes in electroless Ni-P deposits

Electrochemical co-deposition of carbon nanotube/Ni composite layer

Electrophoretic Deposition of Foam Ni/CNT Composites and their Electromagnetic Interference Shielding Performance

Thermal dissipation media for high power electronic devices using a carbon nanotube-based composite

Influence of Carbon Nanotube Coatings on Carbon Fiber by Ultrasonically Assisted Electrophoretic Deposition on Its Composite Interfacial Property.

Thermal Properties of Carbon Nanotube Array Used for Integrated Circuit Cooling

Electrophoretically‐Deposited Metal‐Decorated CNT Nanoforests with High Thermal/Electric Conductivity and Wettability Tunable from Hydrophilic to Superhydrophobic

Investigation of the microstructure and tribological properties of CNTs/Ni composites prepared by electrodeposition

Effect of solution conductivity and electrode shape on the deposition of carbon nanotubes from solution using dielectrophoresis

Enhancement of Natural Convection by Carbon Nanotube Films Covered Microchannel-Surface for Passive Electronic Cooling Devices.

Interface Engineering for High-Performance Thermoelectric Carbon Nanotube Films

The Effect of Pulse Current on Electrolytically Plating Nickel as a Catalyst for Grafting Carbon Nanotubes onto Carbon Fibers via the Chemical Vapor Deposition Method

Nanoscale Heat Transport of Vertically Aligned Carbon Nanotube Bundles for Thermal Management Applications

Hard Carbon Nanotube Sponges for Highly Efficient Cooling via Moisture Absorption–Desorption Process

Optimization of Synthesis Conditions of Carbon Nanotubes via Ultrasonic-Assisted Floating Catalyst Deposition Using Response Surface Methodology

Enhancement of Evaporative Heat Transfer on Carbon Nanotube Sponges by Electric Field Reinforced Wettability

Meaningful improvements on structural-thermal-electronic properties of copper based on 3D nitrogen (N) doped-carbon nanotubes (CNTs) interface fabricated by nano-self-assembly-sintering-modification

Drop impact phenomena and spray cooling on hot nanotextured surfaces of various architectures and dynamic wettability

High-Quality Vertically Aligned Carbon Nanotubes for Applications as Thermal Interface Materials