Abstract:This article proposes a numerical routine to predict the residual stresses developing in an epoxy component during its curing. The scaling of viscoelastic properties with the temperature and the degree of conversion is modeled, adopting a mathematical formulation that considers the concurrent effects of curing and structural relaxation on the epoxy's viscoelastic relaxation time. The procedure comprises two moduli: at first, the thermal–kinetical problem is solved using the thermal module of Ansys and a homemade routine written in APDL, then the results in terms of temperature and the degree of conversion profiles are used to evaluate the viscoelastic functions, and the structural problem is solved in the mechanical module of Ansys, allowing the residual stresses calculation. The results show that the residual stresses mainly arise during cooling and scale with the logarithm of the Biot number.
What problem does this paper attempt to address?
The paper attempts to address the issue of predicting residual stress generated during the curing process of thermosetting polymers (such as epoxy resin). Specifically, the authors propose a numerical model to predict the residual stress in epoxy resin components caused by various physical phenomena (such as thermal expansion/contraction, chemical reactions, viscoelasticity, and structural relaxation) during curing. These residual stresses affect the final product's quality and mechanical properties, making accurate prediction crucial for optimizing manufacturing processes and improving product quality.
### Main Research Content:
1. **Background**:
- Epoxy resin is widely used in various fields due to its unique adhesion, strength, toughness, and processability, such as in electronic packaging, adhesives, coatings, etc.
- During the curing process, epoxy resin gradually transitions from a liquid to a solid state, accompanied by the interaction of multiple physical phenomena such as thermal expansion/contraction, chemical reactions, viscoelasticity, and structural relaxation.
- These phenomena lead to deformation and residual stress in the cured polymer and composite components, affecting their mechanical properties and stability.
2. **Research Objectives**:
- Propose a numerical model to predict the residual stress generated during the curing process of epoxy resin.
- Understand the origins and influencing factors of residual stress through numerical simulation, thereby optimizing the manufacturing process and improving product quality.
3. **Methods and Models**:
- **Mathematical Modeling**: A mathematical model considering the effects of curing and structural relaxation on the viscoelastic time of epoxy resin is proposed.
- **Numerical Simulation**: Ansys software is used for coupled thermodynamic and dynamic problem-solving, and the results are then used in the mechanical module to calculate residual stress.
- **Experimental Validation**: The accuracy of the model is validated through experimental data.
4. **Main Results**:
- Simulation results show that residual stress is mainly generated during the cooling process and is proportional to the logarithm of the Biot number.
- The model can accurately predict the viscoelastic behavior of epoxy resin at different temperatures and curing degrees, providing a theoretical basis for optimizing the manufacturing process.
### Conclusion:
This study successfully predicts the residual stress generated during the curing process of epoxy resin through numerical simulation and reveals the main sources and influencing factors of these stresses. This provides important theoretical support for optimizing manufacturing processes and improving product quality.