Enhanced curing process of eco-friendly oxidized cornstarch adhesive with Nano-CeO2

Shenglong Wang,Qiuyin Zhu,Jinlei Li,Kun Wu,Fenglong Lin,Yincai Wu,Xinkun Wang,Lijun Song
DOI: https://doi.org/10.1080/00218464.2024.2312242
2024-02-03
The Journal of Adhesion
Abstract:This paper investigates the development of an eco-friendly adhesive fortified with cerium dioxide nanoparticles (nano-CeO 2 ), incorporating oxidized corn starch (OCS) and a Polyvinyl acetate (PVAc) emulsion. Initially, OCS was prepared through an oxidation reaction, and its chemical structural attributes were explored using FT-IR, XRD, DSC, viscosity, and carboxyl value analysis. Subsequently, the adhesive formulation (OCS-PVAc-CeO2) was synthesized, demonstrating substantial improvements in both strength and curing kinetics due to the inclusion of nano-CeO 2 , as confirmed by SEM surface morphology analysis. Laboratory-scale evaluations of this adhesive confirmed its suitability for the packaging industry due to its rapid curing process and enhanced mechanical properties.
materials science, multidisciplinary,engineering, chemical,mechanics
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