Abstract:With the rapid development of microelectronics and microelectronics processing technology, manufacturing microelectronic devices by 3D printing technology has become a hot additivemanufacturing direction. In this paper, UV-curable vinyl-terminated polyarylether prepolymer was prepared by nucleophilic substitution reaction with kinked non-coplanar phthalazinone and hexafluoroisopropyl as structural units. A novel low dielectric ink for 3D printing was constructed by using diacrylate reactive diluents and free radical fast initiators. The viscosity of the ink before curing is lower than 300mPa·S, with good processability. After UV and thermal curing, infrared test shows that the curing degree is over 87%, and the curing is complete. Besides, the volume shrinkage is lower than 3.2%. The ink has excellent dimensional stability. After curing, the glass transition temperature of the material can reach up to 210°C, and Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from permissions@acm.org. AIAM2021, October 23–25, 2021, Manchester, United Kingdom © 2021 Association for Computing Machinery. ACM ISBN 978-1-4503-8504-6/21/10. . . $15.00 https://doi.org/10.1145/3495018.3495139 the thermal decomposition temperature is about 350°C, which has the potential for long-term use at 150°C. What’s more, after curing, the dielectric constant of the material can reach about 2.61, and the dielectric loss is only 0.014, which shows excellent dielectric properties. Based on the above excellent comprehensive properties and machinability, the ink can be applied to the manufacturing process of conformal circuit additive with large curvature, with a wide application prospect in microelectronics field.

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