Effect of N–Ni coordination bond on the electrical and thermal conductivity of epoxy resin/nickel‐coated graphite

Ziyi Zhang,Fan Zhang,Junwei Du,Shengfei Hu
DOI: https://doi.org/10.1002/app.55090
IF: 3
2023-12-30
Journal of Applied Polymer Science
Abstract:In this paper, the NCG was modified by EDA to form N‐Ni coordination bonds, which effectively inhibited the agglomeration of NCG in EP matrix. The interfacial resistance between NCG and EP matrix was reduced by the curing effect of EDA on EP. The eletrical and thermal conductivity of EP composites were improved. The agglomeration of nickel‐coated graphite (NCG) in epoxy resin (EP) composites leads to low electrical conductivity of EP composites, which limits their development in electronic devices and multilayer circuits. In order to improve the electrical and thermal conductivity of NCG/EP composites, ethylenediamine (EDA) was used to modify NCG and compared with pure NCG‐filled EP composites. It was found that the conductive effect of modified composites with 20 wt% filler is better than that of unmodified composites with 40 wt% filler. The results of Fourier transform infrared spectroscopy and thermogravimetric analysis of EDA‐modified NCG (ENCG) showed that a coordination adsorption reaction occurred between EDA and NCG, forming N–Ni coordination bonds. When the filling amount of ENCG was 40 wt%, the conductivity and thermal conductivity of the composite are improved most significantly. The volume resistivity was reduced from 2.636 to 0.109 Ω cm, a decrease of 95.85%, and the thermal conductivity was improved from 0.517 to 0.968 W/(m K), an increase of 87.23%, respectively. Meanwhile, ENCG has better dispersion in the EP matrix than NCG.
polymer science
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