Predicting the performance of a heat sink utilized with an energy storage unit using machine learning approach

Ali Salari,Rojin Ahmadi,Mohammad Shahab Vafadaran,Hamid Shakibi,Mohammad Sardarabadi
DOI: https://doi.org/10.1016/j.est.2024.110470
IF: 9.4
2024-04-01
Journal of Energy Storage
Abstract:Combining Heat Sink with Energy Storage Material (HS-ESM) is an innovative method in the thermal management of electronic devices. The configuration of the HS-ESM is an effective method for the thermal management of electronic devices. Therefore, in the present research, the performances of HS-ESM units with two different configurations are numerically evaluated and compared with that of conventional HS. In the first configuration, the space between the fins of the HS is filled with ESM (HS-ESM-I). The second configuration separates the ESM from the HS (HS-ESM-II) and the produced thermal energy by the electronic board is delivered to the ESM through several circular aluminum fins. In order to predict the performance of the systems under various operating conditions, a machine learning model, namely Random Forest (RF) is used and the Harris Hawks Optimizer (HHO) is implemented to optimize the hyperparameters of the machine learning model. According to the simulations, the lowest and highest working duration of the electronic board is for the conventional HS and HS-ESM-II, respectively. The working duration for the conventional HS and HS-ESM-I units is 10 min and 13 min, respectively. At the same operating conditions, the board temperature in the HS-ESM-II unit does not reach the critical value. It is found that increasing the volume fraction of the nanoparticles has a favorable impact on the proficiency of the best cooling unit (HS-ESM-II), declining the steady-state temperature of the board. On top of that, installing metal foam in the energy storage unit reduces the board's steady-state temperature during the working phase from 74.1 °C to 69.3 °C. This strategy reduces the cooling duration of the HS-ESM-II unit from around 90 min to <60 min. Additionally, the trained HHO-RF model can predict the performance of the HS-ESM unit with excellent accuracy. The value of R2 is computed to be higher than 0.99 for predicting the PCB temperature during both the working and resting phases. According to the present study, the proposed HS-ESM-II unit is an effective system for the thermal management of the electronic board.
energy & fuels
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